Imagine a tiny, smart chip that lives inside a giant industrial furnace. It catches the wasted heat from the fire and turns it into a special kind of energy called plasma. This plasma acts like a super-charger for the flame, making the fuel burn much more completely and cleanly.
High-temperature industries struggle with fuel costs and carbon taxes, as hydrogen is 1.5 to 5 times more expensive than natural gas and current combustion efficiency is capped at 98.5%.
A self-powered vacuum nanoelectronic chip (HERC) and heat-powered photon generators that initiate plasma-assisted combustion in industrial boilers.
If you are an iron and steel plant dealing with the high cost of switching to hydrogen—which can be 1.5 to 5 times more expensive than gas—this project developed HERC chips that boost burning efficiency by 18%. This allows you to get more energy out of your fuel and lower your OPEX.
If you are a heating utility dealing with high fuel expenses that make up 96% of life-cycle costs, this project developed a self-powered device that lowers GHG emissions by 20%. It fits into existing boiler systems to increase your return on assets.
If you are a chemical manufacturer dealing with hard-to-abate emissions in systems over 1MW, this project developed HERC technology that increases combustion efficiency by 18%. This helps you move toward CO2 neutrality without replacing your entire boiler infrastructure.
The technology is designed to lower OPEX by increasing combustion efficiency by 18%, which is critical since fuel expenses can represent up to 96% of life-cycle costs in some steam systems.
Yes, HERC chips are designed to be fitted into existing industrial boiler systems. There are an estimated 50,000 suitable systems in the EU alone.
The HERC technology is described as a patented method using self-powered vacuum nanoelectronic chips.
The technology lowers GHG emissions by 20%, helping energy-intensive industries move toward CO2 neutrality.
The project aims for the first industrial installation, with a revenue potential of 105.6M by the end of 2027.
The project is led by a single Estonian SME, Efenco OU, which holds 100% of the industry ratio. This lean structure suggests the technology is proprietary and centrally controlled, focusing on rapid commercialization of their patented HERC chips rather than a broad academic collaboration.
Contact Efenco OU in Estonia for licensing or installation inquiries.
Contact us to connect with Efenco OU for a pilot installation of HERC chips.
