HEATPACK · Project

Advanced Cooling Packages That Keep High-Power Satellite Electronics Running Longer

manufacturingTestedTRL 6

Imagine your laptop overheating and shutting down — now imagine that happening to a satellite worth hundreds of millions, orbiting 36,000 km above Earth with no repair option. HEATPACK built new cooling materials and packaging for satellite electronics that pull heat away far more efficiently than anything available today. They used diamond-based composites and silver sintering techniques to create packages where heat escapes instead of building up. The result: satellite components that last longer, perform better, and don't fry themselves under heavy workloads.

By the numbers

>600 W/m.K

Thermal conductivity of diamond composite baseplates

>10 W/m.K

Thermal interface material conductivity for package-to-structure assembly

TRL 6

Target technology readiness level for space qualification

Consortium partners across 7 countries

67%

Industry partner ratio in consortium

The business problem

What needed solving

High-power satellite electronics are hitting a thermal wall. As telecom payloads demand more power — especially with GaN-based amplifiers — current packaging materials cannot remove heat fast enough, leading to reduced performance, shorter component lifetimes, and reliability risks. Europe also lacks a fully domestic supply chain for advanced thermal management in space-grade electronics, creating strategic vulnerability.

The solution

What was built

The project built two GaN-based demonstration modules: a power supply switching module on multilayer ceramic substrates, and a Ka-band high-power amplifier in a surface-mount hermetic micro package. Supporting these are diamond composite baseplates (>600 W/m.K), silver sintering thermal interface materials, and a silicon block active cooler with embedded micro heat pipes (delivered as breadboard).

Audience

Who needs this

Satellite prime contractors designing next-gen telecom payloadsSpace-grade electronics packaging suppliersGaN component manufacturers targeting space marketsPower conditioning unit makers for aerospace and defenseThermal management material suppliers seeking space qualification

Business applications

Who can put this to work

Satellite Manufacturing

enterprise

Target: Satellite system integrators and telecom payload manufacturers

If you are a satellite manufacturer struggling with thermal limits on your next-gen high-power telecom payloads — this project developed diamond composite baseplates with thermal conductivity exceeding 600 W/m.K and silver sintering assembly techniques, validated to TRL 6 for space environments. These packages let you push more power through GaN amplifiers without redesigning your entire thermal architecture.

Space-Grade Electronics Packaging

mid-size

Target: Companies producing hermetic microelectronics packages for harsh environments

If you are an electronics packaging company looking to serve the growing space market but hitting thermal walls with traditional materials — this project created surface-mount hermetic micro packages for Ka-band high-power amplifiers and multilayer ceramic substrate power modules. The thermal interface materials exceed 10 W/m.K, opening a path to qualify your products for satellite prime contractors.

Defense & Aerospace Power Systems

enterprise

Target: Manufacturers of power conditioning units for aerospace and defense platforms

If you are a power electronics supplier facing demand for smaller, lighter power supply units that handle more heat — this project built a power supply switching module on multilayer ceramic substrates using GaN components with advanced thermal management. The all-European supply chain they validated means you can source these solutions without export control complications.

Frequently asked

Quick answers

What would it cost to adopt these thermal management solutions?

The project data does not include specific pricing for the materials or packages developed. Diamond composite baseplates and silver sintering techniques are premium solutions — expect costs above conventional copper-tungsten or aluminum nitride options. Contact the consortium to discuss volume pricing and licensing terms.

Can these solutions scale to production volumes?

The project targeted TRL 6, meaning the technologies were demonstrated in a relevant environment but not yet in a production line. The consortium includes 6 industrial partners (67% industry ratio) led by Thales Alenia Space, which suggests a clear path to industrialization. Scaling from validated prototypes to series production would be the next step.

What is the IP situation — can I license these technologies?

With 9 partners across 7 countries including major industry players and 3 SMEs, IP ownership is likely shared under the consortium agreement. Interested companies should contact the coordinator (Thales Alenia Space France) to discuss licensing, co-development, or supply agreements for specific components like the diamond composites or thermal interface materials.

How does this compare to current thermal management in satellite electronics?

The diamond composite materials deliver thermal conductivity exceeding 600 W/m.K — significantly above standard materials used in space packaging today. The thermal interface materials for package-to-structure assembly exceed 10 W/m.K with both electrical and thermal properties. These numbers represent a step change from current solutions.

Is this only for space, or can it be used in other industries?

The project was designed and validated for space environments, but the underlying technologies — diamond composites, silver sintering, micro heat pipe cooling — have applications wherever high-power electronics need extreme thermal management. Think 5G base stations, radar systems, electric vehicle power modules, and high-performance computing.

What is the timeline to get these into a real satellite?

The project ran from January 2019 to March 2023 and achieved TRL 6. Moving from TRL 6 to flight qualification (TRL 8-9) typically requires additional testing campaigns and qualification programs. Based on available project data, a flight-ready component could be realistic within 2-3 years of a dedicated qualification effort.

Consortium

Who built it

The HEATPACK consortium is led by Thales Alenia Space France, one of Europe's largest satellite manufacturers — meaning this technology was developed by the people who actually build satellites, not just researchers theorizing about them. With 6 out of 9 partners from industry (67%) and 3 SMEs in the mix, the consortium is heavily tilted toward commercialization. The 7-country spread across Europe (AT, CH, EL, ES, FR, PL, UK) signals a deliberate effort to build an all-European supply chain for these critical thermal management components, reducing dependency on non-European sources. The presence of both large primes and specialized SMEs suggests the technology can enter the market through existing supplier relationships rather than requiring new market entry.

THALES ALENIA SPACE FRANCE SASCoordinator · FR
CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENTparticipant · CH
ALTER TECHNOLOGY TUV NORD SAparticipant · ES
ADAMANT AERODIASTIMIKES EFARMOGES ETAIREIA PERIORISMENIS EFTHYNISparticipant · EL
POLITECHNIKA WARSZAWSKAparticipant · PL
RHP TECHNOLOGY GMBHparticipant · AT
ALTER TECHNOLOGY TUV NORD UK LIMITEDparticipant · UK
UNIVERSITY OF BRISTOLparticipant · UK

How to reach the team

Thales Alenia Space France SAS — reach out to their advanced packaging or thermal engineering division

Order a report on this consortium See THALES ALENIA SPACE FRANCE SAS profile →

Next steps

Talk to the team behind this work.

Want an introduction to the HEATPACK team? SciTransfer can connect you with the right technical contact for licensing, co-development, or supply discussions.

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