SciTransfer
HDLN · Project

High-Density Optical Chips for Ultra-Fast Data Transmission and Telecommunications

digitalTestedTRL 5

Imagine a tiny bridge that converts electrical signals into light pulses. Most current bridges are too bulky or slow, but this project uses a special crystal material to make these bridges much smaller and faster. It's like upgrading from a narrow country road to a high-speed multi-lane highway for data.

By the numbers
150 GHz
Ultrafast modulation bandwidth
200-300 mm
Target silicon photonics wafer scale comparison
The business problem

What needed solving

Current optical modulators are either too large or lack the speed and efficiency needed for next-gen data centers. Existing lithium niobate fabrication is difficult and lacks the density required for mass-market integrated circuits.

The solution

What was built

A commercial foundry service for TFLN including a proprietary DLC etching process and a Process Design Kit (PDK) for professional design software.

Audience

Who needs this

Optical transceiver manufacturersHigh-performance computing (HPC) hardware designersTelecommunications equipment vendorsQuantum photonic circuit developers
Business applications

Who can put this to work

Telecommunications
enterprise
Target: Network Infrastructure Provider

If you are a network provider dealing with data bottlenecks in 5G or 6G networks — this project developed a high-density lithium niobate platform that enables modulation bandwidths beyond 150 GHz. This allows for significantly faster data transfer rates across long-distance fiber optics.

Data Centers
enterprise
Target: Cloud Computing Facility

If you are a data center operator dealing with high energy consumption and heat from electrical interconnects — this project developed a thin-film lithium niobate (TFLN) process that reduces component size and operation voltage. This leads to more efficient, high-density optical interconnects.

Quantum Computing
SME
Target: Quantum Hardware Startup

If you are a quantum hardware developer dealing with signal loss and instability in photonic circuits — this project developed a proprietary etching technology using diamond-like carbon. This ensures low-loss, tightly confining circuits necessary for precise quantum information processing.

Frequently asked

Quick answers

What is the cost or pricing model for this technology?

Based on available project data, specific pricing is not mentioned, but the project aims to establish a commercial foundry service to enable high production volumes.

Can this be produced at an industrial scale?

Yes, the project uses a patented etching process compatible with wafer-scale lithography to move beyond small-scale research samples toward high-volume manufacturing.

What is the IP and licensing status?

The project utilizes a proprietary and patented etching technology employing diamond-like carbon (DLC) to create high-density integrated circuits.

How is this integrated into existing design workflows?

The project is creating a Process Design Kit (PDK) compatible with professional software like Synopsys and open-source tools like gdsfactory.

What is the timeline for commercial availability?

The project period runs from 2023-05-01 to 2026-01-31, suggesting the technology is currently in the development and validation phase.

Consortium

Who built it

The consortium is heavily industry-weighted (60%), consisting of 5 partners across 4 countries (CH, DE, ES, FR). It balances a manufacturing start-up, a design/test house, and a leading communications company, ensuring that the technical development is directly aligned with market validation and industrial application.

How to reach the team

Contact VLC PHOTONICS SL in Spain for foundry service inquiries.

Next steps

Talk to the team behind this work.

Contact us to connect with the HDLN consortium for PDK early access.