Imagine 3D printing a complex metal part, but instead of starting from scratch, you print it directly onto a pre-made base. This is like adding a custom-built Lego tower onto a sturdy foundation, making the process much faster. It allows companies to create high-performance cooling parts for electronics without the slow speeds of traditional 3D printing.
Laser Powder Bed Fusion is too slow and imprecise for mass markets. This prevents the use of complex, high-performance geometries in high-volume industries like power electronics.
A hybrid production process and an advanced machine concept featuring beam splitting and in-situ correction. A cooling device for power electronics was developed as a demonstrator.
If you are an inverter manufacturer dealing with overheating components — this project developed a hybrid LPBF process that builds complex copper cooling structures on ceramic substrates. This improves functional performance and reduces environmental impact.
If you are a component supplier dealing with prohibitive cycle times in 3D printing — this project developed an advanced machine concept with beam splitting and in-situ correction. This enables the production of components on a large scale with micrometer-scale precision.
If you are a converter manufacturer dealing with material waste and low efficiency — this project developed a method where material resources are used close to 100%. This reduces costs and creates unique selling points for high-power hardware.
Based on available project data, costs are reduced by using a hybrid approach that builds on near-net-shape substrates to speed up cycle times and by ensuring material resources are used close to 100%.
Yes, the project specifically targets the multi-billion euro mass market of power electronics by introducing an advanced machine concept that allows for the fixation of multiple substrates and automated laser positioning.
Based on available project data, the project is currently in the execution phase (2024-2026), and specific licensing terms are not yet disclosed.
The system utilizes beam shaping, beam splitting, in-situ geometry correction, and process monitoring and control to ensure defect-free production.
The project aims for a required precision in the low micrometer scale, specifically for building copper geometries on ceramic-based substrates.
The consortium is heavily industry-driven with a 62% industry ratio, consisting of 5 industrial partners (including 3 SMEs) and 3 universities. Led by Robert Bosch GmbH, the group combines global corporate leadership with specialized academic research across 5 countries, indicating a strong push toward commercial viability rather than pure theory.
Contact Robert Bosch GmbH regarding the GlobalAM project
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