Imagine writing circuits inside glass using a laser, like a 3D printer for light. Instead of flat chips, this creates complex 3D networks that move information much faster and with less waste. It turns the slow process of making quantum hardware into something as quick as a few weeks.
Quantum computing hardware is currently limited by slow, expensive, and rigid chip manufacturing processes that struggle with 3D scaling and high signal loss.
A commercial femtosecond laser writing facility and a 64-mode programmable 3D photonic device with dedicated calibration software.
If you are a quantum hardware developer dealing with slow chip fabrication and high signal loss — this project developed a femtosecond laser writing facility that produces 3D photonic chips in as little as 1 month. This allows for faster iteration and scalable modular architectures.
If you are a drug discovery research firm dealing with the massive computing power needed for molecular simulation — this project developed the largest programmable quantum photonic processor in the market. This provides the infrastructure needed to run complex simulations more efficiently.
If you are an encryption software provider dealing with the threat of quantum decryption — this project developed a low-cost, flexible fabrication process for quantum chips. This makes the hardware necessary for quantum-secure communications more accessible.
Based on available project data, the femtosecond laser writing process is lower-cost compared to the fabrication processes used by competitors.
Yes, the project established the first commercial facility in the world for fabricating photonic integrated circuits using this technology, including a custom-made clean room.
Based on available project data, the process was developed by the founding team of Ephos SRL, but specific licensing terms are not provided.
The project aims to demonstrate the capability to manufacture a photonic chip in 2 months, and eventually in 1 month, from design to working device.
The project optimized the packaging process by improving fiber-to-waveguide coupling and the pigtailing process with single fibers and fiber-arrays.
The project is led by a single Italian SME, Ephos SRL. This 100% industry-led structure indicates a strong focus on commercialization and rapid deployment rather than academic research, as the company maintains all in-house manufacturing capabilities.
Contact Ephos SRL in Italy regarding their FLW facility
Contact us to explore partnerships with Ephos for quantum chip prototyping.
