Imagine trying to fit a huge computer into a tiny shoebox; you'd need to shrink the parts and stack them. This project creates a way to build ultra-compact, high-performance circuit boards that can survive the harsh environment of space. It's like upgrading from a standard map to a 3D architectural model to save space and weight.
Current European PCB supply chains struggle to meet the extreme reliability and miniaturization requirements of space applications. This creates a dependency on non-European sources for high-density interconnect (HDI) boards.
The project developed SiP complex Buildup substrates, Power embedded SiP, and HDI PCB building blocks, along with functional RF and digital SiP demonstrators.
If you are a satellite manufacturer dealing with heavy payloads and limited space — this project developed HDI PCB technology that reduces payload and boosts equipment performance for micro and nano satellites.
If you are an electronics supplier dealing with the need for more compact power modules — this project developed Power embedded SiP building blocks that allow for higher integration in small footprints.
If you are a medical device developer dealing with extreme miniaturization requirements — this project developed high-density interconnect (HDI) boards that provide the reliability needed for critical life-support electronics.
Based on available project data, specific pricing or cost-reduction percentages are not provided.
The project aims to build a fully European competitive and independent supply chain, indicating a goal for industrial-scale availability.
Based on available project data, there is no specific mention of licensing terms or patent ownership.
The project runs from 2022-12-01 to 2026-11-30, suggesting the technology will reach its target maturity by late 2026.
The project focuses on upgrading current surface mount technology (SMT) and PCB processes to incorporate HDI and embedded components.
The consortium is heavily industry-driven with an 83% industry ratio, consisting of 6 partners across 4 countries (AT, DK, FR, IT). This high concentration of industrial players, including SMEs, suggests the project is focused on commercial viability and supply chain integration rather than theoretical research.
Contact IMT SRL in Italy for details on HDI PCB supply chain integration.
Contact us to find a partner in the FOCUSING supply chain.
