If you are a chip foundry dealing with the physical limits of 26 nm features — this project developed a lithography approach that enables features of 2 nm. This allows for the production of smaller, more power-efficient leading-edge chips.
Ultra-High Precision Chip Patterning Technology for Next-Generation Semiconductors
Imagine trying to draw a line thinner than a human hair, but then needing to go a thousand times smaller. Current tools are hitting a wall, but this method uses special helium atoms and a unique masking technique to act like a super-fine pen. It allows for patterns so small they can unlock a new era of super-fast computers and quantum devices.
What needed solving
Current photolithography is reaching its physical limits, with the smallest features expected to hit 16 nm by 2028. This limits the performance, power efficiency, and development of quantum and photonic devices.
What was built
A prototype for dispersion force masked-based helium atom lithography and the computational models required to demonstrate the approach.
Who needs this
Who can put this to work
If you are a hardware developer dealing with the need for extreme precision in quantum devices — this project developed a disruptive patterning technology that reaches 2 nm. This opens new markets for quantum devices that were previously impossible to manufacture.
If you are a manufacturer dealing with the integration of light sources into silicon devices — this project developed a 2 nm lithography prototype. This enables the creation of integrated light sources for faster data transmission.
Quick answers
What is the cost or pricing for this technology?
Based on available project data, specific pricing is not listed, but the project has attracted over 450k in early investment and expects to attract more than 3M in private funding by 2026.
Can this be scaled to industrial levels?
Yes, the project includes work on the best approach for industrial upscaling and aims to bring the technology to market by 2031.
What is the IP and licensing status?
The technology is currently protected by two patents.
What is the timeline for commercial availability?
The spin-off company, Lace, intends to bring the technology to the market by 2031.
How is the technology being integrated into current workflows?
Performances are being validated together with Imec, a key actor in the development and early adoption of lithography innovations.
Who built it
The project is a lean partnership between a Norwegian SME (Lace Lithography AS) and a Belgian research entity (Imec). This structure combines the agility of a spin-off with the validation power of one of the world's leading nano-technology hubs, ensuring a direct path from prototype to industrial testing.
Contact Lace Lithography AS in Norway
Talk to the team behind this work.
Contact us to explore licensing opportunities for 2nm lithography.