If you are a display maker dealing with high power drain and low brightness — this project developed Kontrox that demonstrated 250% higher efficiency and 90x less power consumption in microLEDs.
High-Efficiency Semiconductor Surface Treatment to Boost Chip Performance and Reduce Power Waste
Imagine a tiny scratch on a mirror that ruins the reflection; semiconductor chips have similar invisible defects on their surfaces that waste energy. This technology acts like a high-tech polish that removes 98% of these defects and seals the surface. This makes electronic components work much faster and use far less battery power.
What needed solving
Semiconductor manufacturing suffers from surface defects that cause energy leakage and lower chip reliability. This leads to higher power consumption in devices and wasted materials during production.
What was built
A pilot line prototype capable of processing up to 8" substrates and a validated process flow for optoelectronic devices.
Who needs this
Who can put this to work
If you are a chip supplier dealing with reliability issues in power electronic chips — this project developed a passivation technique that reduces surface defects and improves manufacturing yields.
If you are a laser manufacturer dealing with short component lifespans — this project developed a process that increases edge emitting laser power outputs by up to 50% while improving reliability.
Quick answers
What is the cost or price of implementing this technology?
Based on available project data, specific pricing is not disclosed, but the technology is designed to integrate into existing manufacturing flows to optimize yields.
Can this be scaled for mass production?
Yes, the project designed and built a pilot line capable of processing substrates up to 8 inches to demonstrate scalability.
What is the IP status and licensing potential?
The technology is highly protected with 24 patents, indicating a strong foundation for licensing or proprietary use.
How does this integrate with current factory setups?
Kontrox is designed to be combined with existing processing technologies, such as thin film deposition techniques, and integrated into conventional manufacturing flows.
What is the timeline for deployment?
The project concluded in October 2024, having already validated the technology with industrial partners.
Who built it
The project was led by a single Finnish SME, Comptek Solutions Oy, which acted as the sole partner. This lean structure indicates that the core IP and technical execution are centralized within one company, simplifying the commercialization path and IP management.
Contact Comptek Solutions Oy in Finland
Talk to the team behind this work.
Contact us to explore licensing opportunities for Kontrox technology.