Imagine a data center as a giant city where information travels on roads. Current roads often get jammed, but this project builds a smart highway system that can instantly change its lanes and directions. It uses light instead of electricity to move data, making the 'traffic' flow almost instantly without wasting power.
Data centers suffer from high energy consumption and network congestion, which increases the cost per Gbps and creates latency bottlenecks in high-performance computing.
A set of photonic integrated circuits including fast lasers, broadband modulators, and packet switches integrated into modular DIPS cards.
If you are a cloud provider dealing with network congestion and high power bills — this project developed photonic integrated circuits that enable sub-microsecond latency and energy efficiency of ~ fJ/bit. This allows any node to communicate at full capacity, reducing the cost per Gbps.
If you are an AI facility dealing with massive data bottlenecks during model training — this project developed a broadcast-and-select packet switch with 1 ns speed. This ensures full bisection bandwidth, meaning your GPUs can exchange data without waiting in line.
If you are a hardware maker dealing with the high cost of individual optical links — this project developed modular Dynamic Inline Photonic Subsystems (DIPS) cards. These components use silicon-organic hybrid modulators to boost overall network performance rather than just improving single links.
The project reduces the cost per Gbps by implementing low energy (few pJ/bit) photonic integrated circuits and a network architecture that minimizes congestion through full bisection bandwidth.
Yes, the project focuses on modular and scalable subsystems, specifically through the development of Dynamic Inline Photonic Subsystems (DIPS) cards.
Based on available project data, the project involves 8 industrial partners and 3 SMEs, but specific licensing terms are not disclosed in the summary.
It utilizes a hybrid integration platform combining III-V optoelectronics, thick silicon-on-insulator waveguide technology, and silicon-organic hybrid modulators.
The project period runs from 2022-08-01 to 2027-04-30, suggesting it is currently in the development and testing phase.
The consortium is heavily industry-driven, with 80% of the 10 partners being industrial entities, including 3 SMEs. This high industry ratio, spanning 8 countries, indicates a strong focus on commercial viability and a direct pipeline from research to manufacturing.
Contact VTT Finland for technical specifications on DIPS cards.
Contact us to connect with the DYNAMOS industrial partners for early adoption.
