Imagine using a tiny, super-sensitive diamond needle to 'feel' the invisible magnetic leaks in a computer chip. This tool acts like a high-powered magnifying glass that finds microscopic cracks or errors without breaking the chip. It's like finding a needle in a haystack, but the needle is a magnetic glitch and the haystack is a piece of silicon.
Current semiconductor quality control methods like thermal imaging are insufficient for modern miniaturized chips. This leads to higher scrap rates and difficulty in detecting defects in 3D chip stacking and AI accelerators.
The Super-Resolution Quantum Imager (SQI), a non-destructive microscopy tool using diamond NV centers to detect magnetic field alterations.
If you are a chip foundry dealing with high scrap rates during 3D chip stacking, this project developed the SQI imager that detects defects with sub-100 nm resolution. This allows you to find failures faster and reduce waste in production.
If you are a security firm dealing with Hardware-Trojans or side-channel attacks, this project developed a quantum sensing tool that detects magnetic field alterations. This enables the identification of malicious modifications at the hardware level.
If you are a manufacturer dealing with quality control for GaN power devices, this project developed a non-destructive testing system. It provides rapid measurement times of less than 1 minute to ensure device reliability.
Based on available project data, specific pricing or cost details are not provided; however, the company is transitioning from providing testing services to commercializing the SQI system.
Yes, the project aims for TRL9 industrial readiness, focusing on a field of view greater than 50 μm and measurement speeds under 1 minute to fit manufacturing workflows.
The project utilizes proprietary diamond production and software. Based on available project data, specific licensing terms are not listed, but the technology is being integrated into real-world manufacturing.
The system is designed for rapid measurement times in the range of minutes, specifically targeting less than 1 minute per scan.
It serves as a non-destructive alternative to thermal imaging or voltage measurements, specifically for failure analysis and quality control in post-processing.
The project is led by a single German SME, QuantumDiamonds GmbH, which maintains a 100% industry ratio. This lean structure is supported by a high-profile advisory network including TSMC, ARM, Infineon, and Applied Materials, indicating a strong bridge between a small agile developer and the world's largest semiconductor enterprises.
Contact QuantumDiamonds GmbH in Munich, Germany
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