Imagine a tiny brain for a satellite antenna that can steer signals without moving parts. Usually, these parts are bought from outside Europe and are sensitive to space radiation. This project creates a homegrown, tough version that keeps the antenna small, light, and energy-efficient.
European space companies depend on non-EU providers for critical RF components, leaving them vulnerable to ITAR restrictions and supply chain risks. Current antenna arrays are often too heavy, power-hungry, and expensive for mass LEO constellations.
Scalable multi-channel radiation-hard beamforming core-chips for X-band and Ka-band, including a cost-effective plastic non-hermetic packaging process.
If you are a SAR satellite manufacturer dealing with bulky and power-hungry antenna arrays — this project developed radiation-hard core-chips that integrate RF functions into a single chip. This results in a reduction of antenna array size, mass, and power consumption.
If you are a LEO constellation operator dealing with restrictive ITAR regulations on US-made components — this project developed X-band and Ka-band core-chips based on a fully European supply chain. This provides access to space-grade components free from such restrictions.
If you are a packaging provider dealing with high costs of hermetic sealing for space chips — this project developed a cost-effective plastic non-hermetic MMIC packaging process. This allows for robust encapsulation while lowering production costs.
The project reduces costs by integrating multiple RF functions into a single core-chip and implementing a cost-effective plastic non-hermetic MMIC packaging process.
Yes, the project uses a scalable approach that allows for increasing the number of beamforming channels and scaling to higher operational frequencies.
Based on available project data, a dedicated work package is preparing the commercial exploitation and market introduction to make the chips available to the global space industry.
Yes, by establishing a fully European supply chain, the project provides components that are free from ITAR or similar non-European restrictions.
The project period runs from 2022-11-01 to 2026-10-31, with the goal of reaching TRL 7 by the end of the term.
The consortium is heavily industry-driven with an 89% industry ratio, consisting of 8 industrial partners and 1 research entity across 5 countries. With 3 SMEs involved, the group is structured for commercial transition rather than pure academic research, focusing on a fully European supply chain from foundry to packaging.
Contact IHP Solutions GmbH for details on the radiation-hard SiGe BiCMOS technology libraries.
Contact us to connect with the COCHISA consortium for early adoption of ITAR-free beamforming chips.
