Imagine you're making components smaller than a grain of sand — sensors for medical implants, parts for satellites. Right now, checking these tiny pieces for defects is like trying to proofread a book with a magnifying glass while it rolls down a conveyor belt. CITCOM built an automated inspection station that combines X-ray vision and advanced cameras to scan these micro-components in 3D, right on the production line. It spots cracks, stains, and misalignments that human eyes would miss, and feeds that information straight back to the machines so they can fix problems immediately.
Manufacturers of MEMS and micro-components have no suitable in-line inspection equipment for their increasingly 3D devices. Current tools assume flat, planar processing and can't handle complex three-dimensional structures. This blind spot in quality control drives down yields, blocks cost-effective production, and makes it nearly impossible to meet traceability requirements for regulated industries like medical devices and aerospace.
CITCOM built an in-line production inspection and measurement system for micro-components, combining optical scanning, X-ray techniques, computer tomography, and advanced robotics. The system was demonstrated at TRL7 and validated by industrial end users Philips and Microsemi.
If you are a medical device manufacturer struggling with quality traceability under ISO13485 — this project developed an in-line 3D inspection system that automates defect detection in micro-components. It targets 98% yield and 100% reliability while cutting inspection costs by 60%, giving you the device-level traceability that regulators demand.
If you are a MEMS foundry losing yield because your inspection equipment can't handle 3D structures — this project built an automated system combining X-ray CT and optical techniques to analyze defects like fractures, debris, and coating issues directly on the production line. The system was demonstrated at TRL7 with Philips and Microsemi as end-user validators.
If you are an aerospace component supplier where a single defective micro-part can ground an aircraft — this project developed automated inspection that detects stains, fractures, abnormal displacements, and surface coating issues in micro-components. The system provides full production traceability and process feedback, targeting 98% yield for critical applications.
The project objective states the system aims to cut inspection costs by 60% through automated knowledge and inspection-data-based process feedback. This replaces manual or semi-manual inspection with in-line automated 3D scanning.
The system was designed specifically for in-line production use, meaning it operates at production speed on the factory floor. It was developed and demonstrated at TRL7 with industrial end users Philips and Microsemi validating the technology.
The consortium includes 12 partners across 7 countries with 8 industrial partners. CSEM, the coordinator, is a Swiss research and development center. Licensing terms would need to be discussed directly with the consortium, as IP from EU Innovation Actions is typically owned by the partners who generated it.
Based on the project objective, the system detects stains, debris, fractures, abnormal displacements, chemical composition of surface coatings, and surface traces. It combines optical techniques, X-ray, and computer tomography for full 3D analysis of micro-components.
The project specifically mentions ISO13485 traceability requirements as a key driver. The system provides device-level documentation and recording of process data, which is the degree of traceability required for medical device manufacturing.
The system was developed and demonstrated at TRL7, which means it was validated in a relevant production environment. The project ran as an Innovation Action (not basic research), and Philips and Microsemi served as end users and technology validators.
This is a strongly industry-driven consortium with 12 partners across 7 countries (CH, DE, ES, FI, NL, SE, UK). Eight of the twelve partners are industrial, giving a 67% industry ratio — well above average for EU projects. Five partners are SMEs, suggesting a mix of specialized technology providers alongside larger players. The presence of Philips and Microsemi as named end users and validators adds serious commercial credibility, as these are major buyers of micro-component inspection solutions. The coordinator, CSEM, is a well-established Swiss R&D center with deep expertise in microtechnology and industrial transfer.
CSEM Centre Suisse d'Electronique et de Microtechnique, Switzerland — contact through SciTransfer for a warm introduction
Want to explore how CITCOM's inspection technology could fit your production line? SciTransfer can arrange a direct introduction to the development team and help assess compatibility with your manufacturing setup.
