Imagine a camera that can see through thick fog and heavy rain as if it were a clear day. Most car cameras only see what humans see, but this technology adds a special 'infrared' layer that ignores glare and shadows. It's like giving a car a pair of high-tech goggles that work in the worst possible weather.
Current automotive safety systems (ADAS/DMS) fail in fog, heavy rain, and low light because they only see the visible spectrum. Traditional infrared (SWIR) solutions exist but are too expensive for mass-market automotive use.
A multi-spectral image sensor chip using Si and Ge photodiodes and a low-noise ROIC, designed for high-volume HD production.
If you are a supplier dealing with sensors that fail in fog or heavy rain — this project developed a multi-spectral chip that provides clear visibility in critical scenarios. This allows driver monitoring and assistance systems to work when they are most needed, potentially reducing the 70% of accidents caused by poor conditions.
If you are a manufacturer dealing with low-light or smoky environments where standard cameras fail — this project developed a Si and Ge based sensor that can switch between visible and infrared light. This enables more reliable non-invasive quality control and robot navigation.
If you are a developer dealing with the high cost of traditional SWIR imaging — this project developed a chip compatible with standard silicon foundry processes. This brings professional-grade infrared imaging to a price point suitable for mass-market consumer devices.
The technology uses silicon (Si) and germanium (Ge) photodiodes that integrate with standard silicon foundry processes. This allows for a sharp decrease in manufacturing costs compared to traditional SWIR systems.
Yes, the project aims to manufacture a first HD chip ready for high-volume production by leveraging the scalability of mainstream foundry processes.
The technology is based on a unique patented electronic structure for band selection and a novel ROIC design concept that is currently patent pending.
Based on available project data, the demand for DMS and ADAS is growing due to regulatory constraints, and this sensor provides the necessary reliability in harsh conditions to meet those needs.
The project period runs from 2024-12-01 to 2026-11-30, aiming to produce an HD chip ready for high-volume production within this timeframe.
The project is led by a single Italian SME, EYE4NIR SRL, which acts as a fabless image sensor supplier. With a 100% industry ratio and a lean single-partner structure, the project is streamlined for commercial translation rather than academic research, focusing directly on manufacturing a market-ready HD chip.
Contact EYE4NIR SRL in Italy for partnership on HD VIS/SWIR chip integration.
Contact us to connect with EYE4NIR for early adoption of multi-spectral imaging.
