Imagine a camera that can see not just light, but heat and invisible infrared signatures with extreme precision. This project is building a way to stack these sensors like layers of a cake to make them smaller and smarter. It also finds a way to mass-produce these high-tech eyes on larger silicon wafers to bring the cost down for everyday use.
European markets are currently dependent on non-European providers for visible imagers, and LWIR microbolometers are too expensive for high-volume consumer and automotive markets.
The project is building 3D-stacked sensors and 300mm wafer-based microbolometers. They have already produced initial technological bricks and prototypes.
If you are a vehicle interior systems provider dealing with the need for precise driver alertness monitoring — this project developed advanced imaging sensors that enable high-performance in-cabin monitoring. This allows for better safety features without relying on non-European sensor suppliers.
If you are a border control agency dealing with visibility gaps in night or fog — this project developed LWIR and VLWIR imaging solutions that improve border management. These sensors provide high-value thermal imaging to detect intrusions more effectively.
If you are a wildfire detection service dealing with slow response times due to poor visibility — this project developed specialized thermal imagers that facilitate early wildfire detection and monitoring. This helps in protecting forests and urban areas more efficiently.
The project aims to move microbolometer manufacturing from 200mm to 300mm CMOS wafers. This shift increases productivity and allows access to more advanced CMOS nodes to lower the cost-to-performance ratio.
Yes, the project specifically focuses on productivity gains by utilizing 300mm wafers and developing cost-effective wafer-level optic solutions to support widespread industrial adoption.
Based on available project data, the project is managed by a consortium of 24 partners including 18 industry players, but specific licensing terms are not detailed in the summary.
The project uses 3D stacking technologies and improved sensor-processing integration to ensure the chips can be easily integrated into larger systems.
The project period runs from 2024-09-01 to 2027-08-31, suggesting that industrialization efforts will peak toward 2027.
The consortium is heavily industry-driven, with 18 out of 24 partners (75%) coming from the commercial sector, including 7 SMEs. This high industry ratio, combined with the involvement of 10 different countries, indicates a strong focus on commercialization and market readiness rather than pure academic research.
Contact the Commissariat à l'énergie atomique et aux énergies alternatives (CEA) in France.
Contact us to identify the specific industrial partner in the ATHENA consortium for your use case.
