Imagine a single laser that acts like a giant bundle of perfectly spaced colored lights, allowing way more data to travel through a fiber optic cable at once. Instead of using many bulky lasers, this project shrinks everything onto a tiny chip. It's like replacing a whole rack of old lightbulbs with one super-efficient LED strip that handles massive amounts of traffic.
Data centers face a bandwidth bottleneck and soaring energy costs as AI and global traffic grow. Current laser solutions cannot scale efficiently to meet the petabit-per-second speeds required for next-generation computing.
Prototype microcomb modules on a silicon nitride platform and heterogeneous integration methods for coupling III-V materials.
If you are a data center operator dealing with energy consumption projected to reach 3.2% of Europe’s total demand by 2030 — this project developed microcomb modules that enable faster and more energy-efficient communication links inside and between facilities.
If you are a chip maker dealing with the scaling limits of current multi-wavelength lasers — this project developed a wafer-scalable silicon nitride platform that allows for higher bandwidth density through co-packaged optics.
If you are a high-tech manufacturer dealing with the need for ultra-stable frequency sources — this project developed microcombs that can be validated for use in optical clocks.
Based on available project data, specific unit pricing is not provided, but the project focuses on reducing energy costs and using mass-manufacturable platforms to lower long-term expenses.
Yes, the project uses a wafer-scalable silicon nitride platform and heterogeneous integration via micro-transfer printing to ensure the technology is mass-manufacturable.
The intellectual property rights for commercialization are owned by the startup Solinide Photonics AB (formerly Iloomina AB).
The technology is designed for co-packaged optics (CPO), where optoelectronic modules are integrated on the same interposers to shorten electrical interfaces.
The project runs from 2024-08-01 to 2027-07-31, aiming to reach TRL6 demonstrators during this period.
The consortium is heavily industry-weighted (71%), consisting of 5 industrial partners and 2 universities across 5 countries. This structure, featuring 3 SMEs and a strategic partnership with a leader like Nvidia, indicates a strong push toward commercialization rather than pure academic research.
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