Imagine replacing old, bulky power switches with tiny, super-efficient ones that don't waste energy as heat. This project creates a 'toolbox' of advanced materials and designs to make these chips cheaper and more reliable. It's like upgrading the electrical plumbing of a city to stop leaks and save massive amounts of electricity.
Current power electronics suffer from energy waste and bulky designs. There is a need for affordable, high-performance Gallium Nitride (GaN) chips that can be integrated easily into industrial and consumer products to meet climate neutrality goals.
A 'smart GaN Integration Toolbox' consisting of high-performance GaN devices (≤100V and ≥650V), RF GaN on Si concepts, and advanced packaging solutions.
If you are a charger manufacturer dealing with bulky designs and heat loss — this project developed smart GaN IC solutions for ≤100V that reduce energy loss by an average of 30%. This allows for smaller, cooler, and more efficient power bricks.
If you are a network provider dealing with high energy costs for radio towers — this project developed RF GaN on Si integration concepts. This improves the cost and technical performance of radiofrequency switches to lower operational expenses.
If you are an OEM dealing with efficiency losses in high-voltage systems — this project developed benchmark solutions for lateral GaN devices ≥650V. This leads to a 30% average loss reduction in power conversion use cases.
The project focuses on 'affordable' solutions and 'best technical and cost performance' for RF GaN on Si to make these high-efficiency chips commercially viable.
Yes, the project involves 27 industry partners and aims to provide an 'Integration Toolbox' to serve as the backbone for the European Power Electronics Industry.
Based on available project data, the project focuses on road-mapping for long-term exploitation and business cases to ensure European leadership.
The project specifically addresses packaging limits and provides integrated solutions to ensure the shortest time-to-market for components and modules.
The project runs from May 2023 to October 2026, with a focus on reducing cycle times, such as a 40% reduction for 100V buffer stacks.
The consortium is heavily industry-driven, with 27 industrial partners (57% of the group) including 12 SMEs. This strong commercial presence, led by Infineon Technologies Austria AG and supported by 12 universities and 8 research centers across 12 countries, indicates a high priority on commercial viability and industrial application rather than just academic research.
Contact Infineon Technologies Austria AG regarding the GaN Integration Toolbox
Contact us to identify the specific GaN IC benchmarks applicable to your hardware roadmap.
