Imagine trying to build a high-performance engine but not having a way to see the tiny cracks in the metal. This project creates a high-tech 'microscope' and a digital map to find those flaws in new power chips. It helps engineers predict when a part will break before it actually happens, making electronics more reliable.
Current power semiconductors like GaN and SiC suffer from crystal defects and thermo-mechanical fatigue in 3D integration that cannot be accurately measured or predicted with existing tools.
Automated X-ray and electron-probe characterization workflows and predictive multi-physics models for interconnect materials. They also built data parsers and ontologies (CHADA/MODA) for FAIR data management.
If you are an EV Powertrain Manufacturer dealing with overheating and failure in power modules — this project developed characterization workflows and predictive modelling that increase the lifetime and reliability of GaN and SiC components.
If you are a Solar Inverter Producer dealing with efficiency losses in power conversion — this project developed automated X-ray and electron-probe tools that identify crystal defects in semiconductors to improve energy yield.
If you are a Fast-Charging Adapter Manufacturer dealing with the challenges of 3D-integrating small power devices — this project developed thermo-mechanical models for interconnect materials to prevent device fatigue.
Based on available project data, specific pricing or implementation costs are not provided.
The project aims to make characterization techniques quantitative and automated tools specifically for the power semiconductor industry to allow broader and faster market penetration.
Based on available project data, the project emphasizes FAIR and open data practices using the NOMAD repository, but specific licensing terms are not listed.
The project focuses on creating automated workflows and data parsers to ensure characterization data is interoperable and reusable across development and production steps.
The project period runs from 2023-01-01 to 2026-12-31.
The consortium is heavily weighted toward industrial application, with a 45% industry ratio comprising 5 companies, including 3 SMEs. With 11 partners across 6 European countries (AT, BE, CZ, DE, FR, SE), the group balances high-level research from 4 institutes and 2 universities with practical commercial needs, led by the Fraunhofer Society.
Contact Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung EV
Contact us to find a partner for GaN/SiC semiconductor characterization.
