Imagine creating a material as thin as a single layer of atoms that doesn't even exist in nature. By using liquid metals as a base, the team is growing these 'impossible' sheets to act as super-efficient switches and light-emitters. It's like replacing bulky old components with a transparent, ultra-strong film that makes electronics faster and cooler.
Current chip scaling is hitting a wall at the 2 nm node due to energy inefficiency and heat. Traditional materials cannot be made thin enough without losing stability or performance.
The project is building a growth process for non-natural 2D semiconductors (h-GaN, h-SiC) and dielectrics (h-AlN). They developed a real-time monitoring system using Raman spectroscopy and radiation-mode optical microscopy.
If you are a chip manufacturer dealing with the physical limits of 2 nm technology nodes — this project developed 2D semiconductor channels that allow for extreme miniaturization and superb energy efficiency.
If you are an optical interconnect provider dealing with high power consumption in on-chip communications — this project developed 2D LED devices integrated with planar waveguides to increase the efficiency of silicon photonic integrated circuits.
If you are an AI hardware developer dealing with the energy bottleneck of memory access — this project developed twisted bilayer h-AlN that enables ultra-low power ferroelectric tunnel junction memristors for in-memory computing.
Based on available project data, specific unit costs or pricing models are not provided; the project focuses on the engineering and growth methodology using liquid metal catalysts.
The project aims for wafer-scale production and uses liquid metal catalyst substrates to achieve seamless merging of crystals in the mm scale.
Based on available project data, specific patent or licensing terms are not listed, though the project involves 7 partners across 4 countries developing new synthetic techniques.
The materials are designed to be transferable, allowing for the integration of power devices on the back-side of the wafer to decouple power delivery from the signal network.
The project period runs from 2023-10-01 to 2027-09-30, suggesting that commercial readiness would follow the conclusion of this research phase.
The consortium is research-heavy, consisting of 7 partners from 4 countries (DE, EL, FR, NL). With 3 research centers, 2 universities, and 2 SMEs, the industry ratio is 14%, indicating the project is primarily in the high-risk, high-reward discovery phase rather than immediate commercial production.
Contact the National Center for Scientific Research 'Demokritos' in Greece
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