All four H2020 projects (TOP HIT, MICROPRINCE, Caladan, HIPERION) center on micro-transfer printing as the core integration method.
X DISPLAY COMPANY TECHNOLOGY LIMITED
Irish specialist in micro-transfer printing for assembling photonic components, lasers, and solar cells onto semiconductor wafers at industrial scale.
Their core work
X-CELEPRINT specializes in micro-transfer printing (MTP) technology — a process for picking up tiny functional components (chips, lasers, solar cells) from one substrate and precisely placing them onto another. Their core business is enabling heterogeneous integration: combining different semiconductor materials (like GaAs and silicon) on a single platform, which is critical for advanced photonics and high-efficiency solar cells. They operate at the intersection of semiconductor manufacturing and photonic assembly, contributing MTP expertise to pilot production lines and industrial-scale demonstrations.
What they specialise in
Caladan focused on Terabit/s optical transceivers using MTP for GaAs quantum dot laser assembly on silicon photonics platforms; TOP HIT addressed heterogeneous integration for photonic components.
HIPERION targeted 30% efficiency hybrid photovoltaics using optical micro-tracking and multijunction solar cells assembled via transfer printing.
MICROPRINCE built a pilot line for micro-transfer-printing functional components at wafer level; TOP HIT developed transfer-print operations for heterogeneous integration.
How they've shifted over time
X-CELEPRINT's early H2020 work (2015–2018) focused on proving the core micro-transfer printing process and establishing wafer-level pilot lines through TOP HIT and MICROPRINCE — essentially building the manufacturing foundation. From 2019 onward, their focus shifted to applying MTP in two distinct high-value domains: datacom photonics (Caladan, assembling GaAs quantum dot lasers onto silicon photonics chips) and next-generation solar energy (HIPERION, multijunction cells with 30% efficiency targets). This trajectory shows a clear move from process development to application-specific deployment.
X-CELEPRINT is moving from proving its MTP technology toward deploying it in high-growth photonics and renewable energy markets, making them increasingly relevant for partners needing advanced semiconductor assembly at scale.
How they like to work
X-CELEPRINT has participated exclusively as a partner — never as coordinator — across all four projects, suggesting they serve as a specialist technology contributor rather than a project leader. With 35 unique consortium partners across 12 countries, they connect widely but contribute a focused, well-defined capability (micro-transfer printing) to each consortium. This makes them a low-overhead partner: they bring a specific, hard-to-replicate skill without requiring management bandwidth.
X-CELEPRINT has built a broad European network spanning 35 partners in 12 countries, indicating they are sought after by diverse consortia needing their niche MTP capability. Their partnerships span both ICT/digital and energy pillars, giving them cross-domain connections.
What sets them apart
X-CELEPRINT occupies a rare niche: they are one of very few European companies offering industrial-grade micro-transfer printing for heterogeneous semiconductor integration. This technology is a bottleneck for anyone trying to combine different chip materials (III-V on silicon, for example), making X-CELEPRINT a critical enabler rather than a competitor to their partners. Their ability to apply the same core process to both photonics and solar energy gives consortium builders flexibility — one partner covering assembly needs across multiple technology domains.
Highlights from their portfolio
- TOP HITTheir largest funded project (EUR 552,500), establishing the foundational transfer-print technology for heterogeneous integration.
- HIPERIONAmbitious cross-sector move into hybrid photovoltaics targeting 30% efficiency — demonstrates the versatility of their MTP platform beyond digital/photonics.
- CaladanTargets Terabit/s optical transceivers for datacom, positioning MTP technology at the frontier of high-speed data communication infrastructure.