TELEDYNE E2V SEMICONDUCTORS SAS

Their core work

Teledyne e2v Semiconductors designs and manufactures high-reliability mixed-signal semiconductors — particularly high-speed analog-to-digital and digital-to-analog data converters — for space and aerospace systems. Their chips sit inside satellite payloads used for telecommunications, Earth observation, and navigation, handling the conversion between the analog RF world and the digital processing world onboard spacecraft. The Saint-Égrève site specialises in BiCMOS process technology, flip-chip assembly, and non-hermetic packaging qualified for the harsh radiation and thermal environment of orbit. They are one of Europe's few independent suppliers of radiation-tolerant data converters, reducing European dependence on US components for strategic space programmes.

What they specialise in

How they've shifted over time

Early H2020 work (2016-2018, INTERSTELLAR) was squarely on the core of the satellite payload — high-speed ADC/DAC converters, high-bandwidth serial links, BiCMOS process and flip-chip non-hermetic packaging for telecom, Earth observation and navigation platforms, and they led from the front as coordinator. From 2020 the emphasis broadens toward the antenna and terminal side of the space link, entering FLEXCOM as a participant on phased-array SatCom user terminals. The trajectory moves from onboard payload silicon toward end-to-end SatCom chains, though recent involvement is at a much smaller participant scale.

They are extending from satellite payload silicon into the ground-segment and user-terminal electronics of the broader SatCom value chain, making them a plausible partner for next-generation connectivity missions.

How they like to work

They operate as a technical anchor: when the project centres on the semiconductor itself they take the coordinator seat (INTERSTELLAR, EUR 3.82M, consortium of 13+ partners), and when the project is about integrating components into a larger system they join as a specialist participant with a small budget share (FLEXCOM, EUR 67K). This split — lead on core IP, contribute on adjacent systems — is characteristic of a strategic component supplier staying close to its customers without diluting focus.

Two H2020 projects have connected them with 14 unique partners across 6 countries, a European-weighted network built around space electronics prime contractors, research institutes and terminal integrators.

What sets them apart

As the French semiconductor arm of Teledyne e2v, they are one of the very few European suppliers capable of delivering space-qualified high-speed data converters at industrial volumes — a component category historically dominated by US vendors and subject to ITAR friction. Partnering with them gives a consortium direct access to the chip, the process technology and the qualification dossier, not just a board-level integrator. For any digital payload or SatCom programme aiming at European non-dependence, they are a short-list name rather than an interchangeable participant.

Highlights from their portfolio

• INTERSTELLAR
  Coordinator role with EUR 3.82M EC funding — a flagship RIA to develop Europe's next generation of high-speed space-grade data converters for telecom, Earth observation and navigation payloads.
• FLEXCOM
  Signals a strategic move beyond onboard payload silicon into flexible phased-array SatCom user terminals, positioning them in the ground/terminal segment.