Central participant in PIXAPP pilot line and third-party contributor to InPulse indium-phosphide PIC ecosystem.
TECHNOBIS IPPS BV
Dutch SME specializing in photonic integrated circuit sensing systems for industrial monitoring, aerospace composites, and PIC pilot lines.
Their core work
Technobis IPPS is a Dutch SME specializing in integrated photonic pressure sensors and fiber optic sensing systems. They contribute photonic sensing expertise to EU pilot lines and industrial applications, supporting both the assembly and packaging of photonic integrated circuits (PICs) and structural health monitoring of composite structures. Their work spans from PIC manufacturing ecosystem development to embedding sensing technologies in demanding environments such as high-temperature aerospace composites.
What they specialise in
Sensing expertise is the common thread across all three projects — from PIC sensors (PIXAPP) to structural health monitoring (SuCoHS) to InP-based photonics (InPulse).
Third-party contributor to SuCoHS, applying sensing technology to fire-resistant composite structures in transport.
Third-party role in InPulse pilot line, the most recent project (2019-2023), suggests growing involvement in InP-based PIC manufacturing.
How they've shifted over time
Technobis entered H2020 through PIXAPP (2017), focused on broad PIC ecosystem capabilities — assembly, packaging, testing, and reliability across multiple application domains including medical, communications, and security. By 2018-2019, their involvement shifted toward more specialized applications: embedding sensing in high-temperature composite structures (SuCoHS) and contributing to indium-phosphide pilot lines (InPulse). The trajectory shows a company moving from general photonic packaging support toward targeted sensing applications in aerospace/transport and next-generation semiconductor materials.
Technobis is deepening its niche in photonic sensing for industrial and transport applications, moving from pilot line support roles toward specialized sensing integration in demanding environments.
How they like to work
Technobis operates almost exclusively as a specialist contributor rather than a project leader — zero coordinator roles, with two of three projects as a third party. This is typical for a focused SME that provides a specific technology component (photonic sensors) to larger consortia. With 47 unique partners across 13 countries from just 3 projects, they plug into large, well-connected consortia and gain wide exposure through their specialist niche.
Despite only three projects, Technobis has touched 47 unique partners across 13 countries, reflecting their involvement in large-scale pilot line consortia. Their network is broad and European in scope, driven by the multi-partner structure of PIC ecosystem projects.
What sets them apart
Technobis occupies a specific niche at the intersection of photonic integrated circuits and industrial sensing — they don't just make PICs, they apply photonic sensing to real-world structural and environmental monitoring challenges. Their ability to bridge the photonics manufacturing world (PIXAPP, InPulse) with end-use sectors like aerospace composites (SuCoHS) makes them a valuable connector between semiconductor pilot lines and application-driven projects. For consortium builders, they offer a ready-made photonic sensing component provider with proven experience in multi-partner EU projects.
Highlights from their portfolio
- PIXAPPTheir only direct-funded project (EUR 512K), a major EU pilot line for photonic integrated circuit assembly and packaging — the backbone of their H2020 profile.
- SuCoHSShows cross-sector versatility: applying photonic sensing expertise to high-temperature composite structures in transport, far from their home turf of PIC manufacturing.