SciTransfer
Organization

TECHNOBIS IPPS BV

Dutch SME specializing in photonic integrated circuit sensing systems for industrial monitoring, aerospace composites, and PIC pilot lines.

Technology SMEdigitalNLSMENo active H2020 projectsThin data (2/5)
H2020 projects
3
As coordinator
0
Total EC funding
€512K
Unique partners
47
What they do

Their core work

Technobis IPPS is a Dutch SME specializing in integrated photonic pressure sensors and fiber optic sensing systems. They contribute photonic sensing expertise to EU pilot lines and industrial applications, supporting both the assembly and packaging of photonic integrated circuits (PICs) and structural health monitoring of composite structures. Their work spans from PIC manufacturing ecosystem development to embedding sensing technologies in demanding environments such as high-temperature aerospace composites.

Core expertise

What they specialise in

Photonic integrated circuit assembly and packagingprimary
2 projects

Central participant in PIXAPP pilot line and third-party contributor to InPulse indium-phosphide PIC ecosystem.

Fiber optic and photonic sensing systemsprimary
3 projects

Sensing expertise is the common thread across all three projects — from PIC sensors (PIXAPP) to structural health monitoring (SuCoHS) to InP-based photonics (InPulse).

Structural health monitoring for compositessecondary
1 project

Third-party contributor to SuCoHS, applying sensing technology to fire-resistant composite structures in transport.

Indium-phosphide photonicsemerging
1 project

Third-party role in InPulse pilot line, the most recent project (2019-2023), suggests growing involvement in InP-based PIC manufacturing.

Evolution & trajectory

How they've shifted over time

Early focus
PIC assembly and packaging
Recent focus
Sensing for composites and InP photonics

Technobis entered H2020 through PIXAPP (2017), focused on broad PIC ecosystem capabilities — assembly, packaging, testing, and reliability across multiple application domains including medical, communications, and security. By 2018-2019, their involvement shifted toward more specialized applications: embedding sensing in high-temperature composite structures (SuCoHS) and contributing to indium-phosphide pilot lines (InPulse). The trajectory shows a company moving from general photonic packaging support toward targeted sensing applications in aerospace/transport and next-generation semiconductor materials.

Technobis is deepening its niche in photonic sensing for industrial and transport applications, moving from pilot line support roles toward specialized sensing integration in demanding environments.

Collaboration profile

How they like to work

Role: third_party_expertReach: European13 countries collaborated

Technobis operates almost exclusively as a specialist contributor rather than a project leader — zero coordinator roles, with two of three projects as a third party. This is typical for a focused SME that provides a specific technology component (photonic sensors) to larger consortia. With 47 unique partners across 13 countries from just 3 projects, they plug into large, well-connected consortia and gain wide exposure through their specialist niche.

Despite only three projects, Technobis has touched 47 unique partners across 13 countries, reflecting their involvement in large-scale pilot line consortia. Their network is broad and European in scope, driven by the multi-partner structure of PIC ecosystem projects.

Why partner with them

What sets them apart

Technobis occupies a specific niche at the intersection of photonic integrated circuits and industrial sensing — they don't just make PICs, they apply photonic sensing to real-world structural and environmental monitoring challenges. Their ability to bridge the photonics manufacturing world (PIXAPP, InPulse) with end-use sectors like aerospace composites (SuCoHS) makes them a valuable connector between semiconductor pilot lines and application-driven projects. For consortium builders, they offer a ready-made photonic sensing component provider with proven experience in multi-partner EU projects.

Notable projects

Highlights from their portfolio

  • PIXAPP
    Their only direct-funded project (EUR 512K), a major EU pilot line for photonic integrated circuit assembly and packaging — the backbone of their H2020 profile.
  • SuCoHS
    Shows cross-sector versatility: applying photonic sensing expertise to high-temperature composite structures in transport, far from their home turf of PIC manufacturing.
Cross-sector capabilities
Transport — structural health monitoring for aerospace compositesManufacturing — Industry 4.0 sensor integration and quality monitoringHealth — medical photonic sensing devicesSecurity — photonic sensing for detection and monitoring
Analysis note: Profile based on only 3 projects, two as third party with no direct funding data. The company name (IPPS — likely Integrated Photonic Pressure Sensors) and project keywords strongly suggest photonic sensing as the core business, but the limited project count and predominantly third-party roles mean the profile captures only a slice of their actual capabilities. No website was provided for verification.