Central to PHABULOUS (pilot-line for free-form micro-optics), PhotonicLEAP (wafer-level integration packaging), and NOLOSS (photon management at different length scales).
SUSS MICROOPTICS SA
Swiss micro-optics manufacturer specializing in wafer-level production, UV-NIL replication, and photonic packaging for sensors, medical, and communications applications.
Their core work
SUSS MicroOptics is a Swiss manufacturer specializing in micro-optical components, particularly wafer-level micro-optics fabricated using UV imprint and lithography techniques. They provide design, prototyping, and volume production of micro-lenses and free-form optical elements for photonic integrated circuits, sensors, medical devices, and communications systems. Their core value lies in bridging the gap between optical design and scalable manufacturing — taking micro-optics from lab prototypes to pilot-line and industrial-scale production.
What they specialise in
PIXAPP focused on PIC assembly and packaging pilot lines; PhotonicLEAP addresses wafer-level integration, packaging, and test for PICs.
PHABULOUS explicitly targets UV-NIL lithography/replication at wafer scale, roll-to-plate, and roll-to-roll formats.
NOLOSS addressed optical design for manufacture at different length scales; PHABULOUS includes micro-optics design tools and pilot line production.
PIXAPP addressed supply chain and standards for photonic packaging; PhotonicLEAP works on standard designs and process design kits for open access pilot lines.
How they've shifted over time
Early H2020 involvement (2016–2018) centered on photon management fundamentals and establishing photonic packaging infrastructure — with NOLOSS exploring optical design for manufacture and PIXAPP building assembly/packaging pilot lines across sensors, medical, and communications applications. From 2020 onward, the focus shifted decisively toward advanced manufacturing techniques: free-form micro-optics, UV-NIL lithography, roll-to-roll replication, and wafer-level integration with standardized process design kits. The trajectory shows a clear move from participating in broad photonics ecosystem projects to deep specialization in scalable micro-optics production methods.
SUSS MicroOptics is investing heavily in pilot-line-ready manufacturing for free-form micro-optics and wafer-level photonic packaging — expect them to become a go-to production partner for anyone needing micro-optical components at scale.
How they like to work
Always a participant, never a coordinator — SUSS MicroOptics joins consortia as a specialized manufacturing partner contributing production expertise rather than leading project direction. With 53 unique partners across 12 countries in just 4 projects, they operate in large, diverse consortia typical of pilot-line and infrastructure projects. This pattern suggests they are a trusted industrial contributor that research-heavy consortia bring in when they need a credible path from lab optics to volume production.
Despite only 4 projects, SUSS MicroOptics has built a broad European network of 53 partners across 12 countries — a direct result of participating in large-scale pilot-line initiatives that unite photonics research organizations, foundries, and end-users across the continent.
What sets them apart
SUSS MicroOptics occupies a rare position as a private company that can take micro-optical designs and manufacture them at wafer scale using advanced replication techniques like UV-NIL lithography. While many photonics companies focus on either design or assembly, SUSS covers the full path from optical design through pilot-line production — making them especially valuable for projects that need to demonstrate manufacturing readiness. Their Swiss base and non-SME status suggest an established industrial operation with the capacity and reliability that large EU consortia require.
Highlights from their portfolio
- PHABULOUSLargest funding (EUR 812K) — a dedicated pilot line for free-form micro-optics manufacturing using UV-NIL, wafer-scale, and roll-to-roll techniques, representing their core business at its most ambitious.
- PhotonicLEAPAddresses wafer-level photonic integration packaging and test with open-access pilot lines and standardized process design kits — positioning SUSS as part of the emerging European photonics manufacturing infrastructure.
- PIXAPPOne of Europe's first photonic integrated circuit assembly and packaging pilot lines, giving SUSS early entry into the PIC packaging ecosystem across sensors, medical, communications, and security applications.