SciTransfer
Organization

SMARTRAC TECHNOLOGY GMBH

German NFC and RFID technology manufacturer with EU research experience in printed smart packaging and advanced semiconductor integration.

Large industrial companydigitalDENo active H2020 projectsThin data (2/5)
H2020 projects
2
As coordinator
0
Total EC funding
€582K
Unique partners
21
What they do

Their core work

Smartrac Technology is a German manufacturer specializing in RFID and NFC technology — producing smart inlays, labels, tags, and packaging solutions embedded with contactless communication chips. Their core business sits at the intersection of printed electronics and connected packaging, enabling physical objects to carry digital identity and interact with smartphones or readers. In H2020 projects, they contributed industrial expertise in NFC-enabled game cards and consumer packaging (PING) and advanced semiconductor integration techniques related to More-than-Moore technologies (ADMONT). They represent the applied manufacturing end of the digital identity and smart packaging value chain.

Core expertise

What they specialise in

NFC and RFID smart packagingprimary
1 project

PING project (2015-2017) focused directly on printed intelligent NFC game cards and packaging, aligning with Smartrac's core commercial product line.

1 project

PING project involved metal oxide design and printed electronics manufacturing, core techniques in Smartrac's NFC inlay production process.

Advanced semiconductor integration (More-than-Moore)secondary
1 project

ADMONT project (2015-2019) addressed distributed pilot lines for More-than-Moore technologies, extending beyond standard chip scaling into heterogeneous integration.

Connected consumer goods and smart labelssecondary
1 project

PING project specifically targeted game cards and consumer packaging as an application domain, linking NFC technology to brand protection and consumer engagement.

Evolution & trajectory

How they've shifted over time

Early focus
NFC packaging, printed electronics
Recent focus
Advanced semiconductor integration

Both H2020 projects launched in the same year (2015), so there is no meaningful temporal shift observable from this dataset alone. The early-period keywords — printed NFC packaging and metal oxide design — represent Smartrac's established industrial identity at the time of EU project entry. With no later-stage H2020 projects to compare against, it is not possible to confirm whether their EU research focus evolved; their commercial trajectory, however, moved toward broader IoT connectivity and eventually led to their acquisition by Avery Dennison in 2019, suggesting a strategic pivot toward large-scale supply chain and retail tagging.

With only two projects both launched in 2015 and no subsequent H2020 participation, Smartrac's EU research trajectory appears to have been a limited, time-bounded engagement rather than an ongoing research program — likely tied to specific product development needs at that time.

Collaboration profile

How they like to work

Role: specialist_contributorReach: European10 countries collaborated

Smartrac participated exclusively as a consortium partner in both projects, never taking the coordinator role — consistent with a large industrial company contributing manufacturing expertise and pilot-line access rather than research leadership. Their involvement in ECSEL-IA (an industry-heavy semiconductor program) and a standard RIA suggests they bring applied, production-side capability to research consortia. With 21 partners across 10 countries from just two projects, they engaged in medium-to-large consortia typical of ECSEL joint undertakings.

Smartrac built a network of 21 unique partners across 10 countries through only two projects, indicating participation in broad, multi-stakeholder consortia rather than tight bilateral partnerships. Their geographic spread across Europe reflects the pan-European nature of ECSEL and ICT research programs rather than a regionally focused collaboration strategy.

Why partner with them

What sets them apart

Smartrac brought rare industrial-scale NFC manufacturing capability into academic and applied research consortia — a role few German companies could fill at the printed electronics and smart packaging intersection. Their value to a consortium is access to real production environments, not just lab prototypes, which is especially relevant for ECSEL-type projects requiring pilot line validation. Note that Smartrac was acquired by Avery Dennison in 2019, so prospective partners should verify current organizational structure and research activity before initiating contact.

Notable projects

Highlights from their portfolio

  • PING
    Largest funding award (EUR 491,500) and directly maps to Smartrac's core commercial product — NFC-enabled game cards and consumer packaging — making it the clearest window into their applied technology capabilities.
  • ADMONT
    Participation in an ECSEL Innovation Action on More-than-Moore semiconductor integration signals access to advanced heterogeneous electronics manufacturing, broadening Smartrac's profile beyond pure NFC tagging.
Cross-sector capabilities
Smart packaging for food safety and traceabilityBrand protection and anti-counterfeiting in manufacturingIoT device integration for retail and logistics
Analysis note: Only 2 projects, both initiated in 2015 — no temporal evolution is observable from H2020 data alone. Smartrac was acquired by Avery Dennison in 2019; current entity status under that name should be verified before outreach. The ADMONT project keywords were absent from the dataset, limiting depth of analysis for that project.