SENCIO BV

Their core work

Sencio is a Dutch SME specializing in advanced semiconductor packaging, micro-assembly, and system-in-package (SiP) solutions. They provide expertise in technologies such as Fan-Out Wafer Level Packaging (FOWLP), 3D integration, and MEMS micro-fabrication for demanding RF, optical, and mixed-signal applications. Their work spans from designing packaging architectures for satellite communications and 5G base stations to enabling micro mirror arrays for holographic displays. They act as a packaging and integration specialist that bridges the gap between chip-level design and system-level performance.

What they specialise in

How they've shifted over time

Sencio's early H2020 work (2015–2018) centered on traditional advanced packaging for RF and space applications — satellite microwave components (PAMPA) and establishing European SiP/FOWLP manufacturing capabilities (EuroPAT-MASIP). From 2018 onward, their focus shifted toward higher-frequency 5G systems with GaN integration, and most recently into micro-optical MEMS for holographic displays (REALHOLO). The constant thread is advanced packaging and micro-assembly, but the application domains have broadened significantly from space/telecom into consumer-facing mixed-reality technology.

Sencio is expanding from traditional RF packaging into micro-optical and MEMS domains, positioning themselves at the intersection of semiconductor packaging and emerging display technologies.

How they like to work

Sencio participates exclusively as a partner, never as coordinator, which is typical of a focused technical SME that contributes deep specialist knowledge rather than managing large consortia. Despite only four projects, they have worked with 53 unique partners across 16 countries, indicating they integrate into large, diverse consortia rather than repeating with the same clusters. This broad network suggests they are easy to onboard and valued for their specific packaging expertise across different application domains.

Sencio has built a remarkably wide network for a small company — 53 consortium partners across 16 countries through just four projects. This reflects participation in large-scale European pilot lines and research initiatives rather than small bilateral collaborations.

What sets them apart

Sencio occupies a niche that few European SMEs cover: advanced packaging and micro-assembly services that bridge the gap between semiconductor fabrication and system integration. Their ability to apply the same core packaging competence across very different sectors — from satellite payloads to 5G base stations to holographic displays — makes them a versatile integration partner. For consortium builders, they offer hands-on packaging and assembly expertise without the overhead or IP constraints of a large semiconductor foundry.

Highlights from their portfolio

• REALHOLO
  Their largest-funded project (€267K) and a significant pivot into micro-optical MEMS for holographic mixed-reality displays, signaling a new strategic direction.
• 5G_GaN2
  Positioned Sencio in the European 5G supply chain with GaN-based RF packaging for millimeter-wave base stations, a high-demand application area.
• EuroPAT-MASIP
  Part of a European pilot line for advanced SiP manufacturing — demonstrates Sencio's role in establishing continental packaging infrastructure.