SEMPA SYSTEMS GMBH

Their core work

SEMPA Systems GmbH is a Dresden-based technology SME operating at the intersection of advanced semiconductor manufacturing and power electronics. Their work spans precision additive manufacturing using atomic layer deposition for microsystems and MEMS devices, as well as the packaging and reliability engineering of GaN (gallium nitride) power semiconductors for demanding applications in automotive, industrial, and renewable energy systems. Based in Silicon Saxony — Germany's premier semiconductor region — they bring specialist fabrication and materials expertise to large European R&D consortia. Their practical focus is on turning advanced semiconductor materials and deposition processes into robust, field-ready power conversion components.

What they specialise in

How they've shifted over time

SEMPA's earliest H2020 engagement (ATOPLOT, 2020) was rooted in nano-scale fabrication — atomic layer deposition and precision 3D printing for microelectromechanical systems — suggesting a background in advanced materials processing and micro-device manufacturing. By 2021, their second project (GaN4AP) had shifted the focus decisively toward power electronics: GaN semiconductors, energy efficiency, and the reliability demands of automotive and grid-tied power conversion. This trajectory suggests SEMPA is moving from materials and fabrication science toward applied power electronics, using their deep knowledge of semiconductor processes to address the packaging and durability challenges that limit GaN adoption in high-stakes systems.

SEMPA appears to be positioning itself as a specialist in GaN semiconductor reliability and packaging — a critical bottleneck as the automotive and renewable energy industries scale up wide-bandgap power electronics adoption.

How they like to work

SEMPA participates exclusively as a consortium partner, never as a project coordinator, which is consistent with a specialist SME that contributes targeted technical expertise rather than leading programme management. Both of their projects are Innovation Actions — applied, industry-facing projects — which signals that they are engaged at the technology development and validation stage, not pure research. With 47 unique consortium partners drawn from just two projects, they operate within large, multi-partner consortia, likely valued for their specific fabrication or characterisation capabilities rather than broad project leadership.

SEMPA has built a surprisingly broad network of 47 unique partners across 9 countries from only two projects, reflecting the large consortium structures typical of H2020 Innovation Actions. Their Dresden location anchors them in the Silicon Saxony cluster, which likely shapes their industrial connections toward German and European semiconductor supply chains.

What sets them apart

SEMPA occupies a rare dual niche: advanced nano-scale deposition and additive manufacturing on one hand, and GaN power semiconductor reliability engineering on the other. Few SMEs bridge atomic-level fabrication processes and system-level power electronics validation, making SEMPA a potentially distinctive partner for consortia that need to close the gap between materials innovation and industrial deployment. Their Dresden base further connects them to one of Europe's densest semiconductor ecosystems, giving them proximity to both research institutes and industrial integrators.

Highlights from their portfolio

• GaN4AP
  With a four-year timeline (2021–2025) and focus on GaN reliability across three high-growth application areas — automotive charging, industrial motor drives, and solar inverters — this project places SEMPA at the centre of Europe's wide-bandgap power electronics push.
• ATOPLOT
  The largest funding award for SEMPA (€346,229) and their earliest H2020 entry, this project on atomic-layer 3D printing for MEMS reveals a foundational capability in precision nano-fabrication that underpins their semiconductor materials expertise.