RECIF TECHNOLOGIES

Their core work

RECIF Technologies is a French SME that designs and manufactures precision wafer handling and transfer equipment for the semiconductor industry. Their core business is building the robotic systems that move silicon wafers between process steps in chip fabrication — a critical enabler for advanced node manufacturing. Through six consecutive EU semiconductor projects, they have contributed equipment expertise as fabs push from 7nm down to 2nm process nodes, making them a specialized supplier in Europe's semiconductor equipment ecosystem.

What they specialise in

How they've shifted over time

RECIF's early H2020 work (2015–2019) focused broadly on semiconductor process equipment and materials for the 7nm and 5nm nodes — contributing to the general push toward smaller transistors. From 2019 onward, their involvement deepened significantly: projects became more specific, keywords expanded to include lithography, metrology, heterogeneous integration, and design-technology co-optimization (DTCO/STCO). Their EC funding nearly quadrupled from the earliest to the latest project, suggesting an increasingly central technical contribution as Europe's semiconductor ambitions grew more aggressive.

RECIF is moving toward equipment for sub-2nm manufacturing and heterogeneous integration, positioning them at the heart of Europe's semiconductor sovereignty push.

How they like to work

RECIF always participates as a partner, never as coordinator — consistent with their role as a specialized equipment supplier embedded in large industry-led consortia. With 99 unique partners across 15 countries, they operate in massive ECSEL/KDT consortia typical of Europe's semiconductor pilotline projects. This makes them a reliable, low-friction consortium member that major chipmakers and research institutes already know how to work with.

RECIF has collaborated with 99 distinct partners across 15 countries through large-scale semiconductor consortia. Their network spans Europe's major chip manufacturing hubs, connecting them to leading fabs, equipment makers, and research institutes in the ECSEL/KDT ecosystem.

What sets them apart

RECIF occupies a narrow but critical niche: they are one of very few European SMEs specializing in wafer handling equipment for the most advanced semiconductor nodes. While large players dominate lithography and etching, precision wafer transport is essential infrastructure that every fab needs. Their unbroken chain of six projects tracking each technology node from 7nm to 2nm demonstrates continuity and trust from Europe's semiconductor community — a track record difficult for newcomers to replicate.

Highlights from their portfolio

• ID2PPAC
  Their largest-funded project (EUR 327K) targeting 2nm node integration — represents their most advanced and prominent contribution to date.
• IT2
  Marked a significant step up in funding (EUR 247K) and scope, covering the full 2nm technology stack from lithography to heterogeneous integration.
• SeNaTe
  Their first H2020 semiconductor project (7nm node, 2015), establishing the starting point of a continuous progression through every major technology node.