PACKAGING SIP

Their core work

PACKAGING SIP is a French SME specializing in advanced semiconductor packaging, with a core focus on System-in-Package (SiP) architectures that integrate multiple chips into a single compact module. Their technical work centers on Fan-Out Wafer-Level Packaging (FOWLP) and embedded Wafer-Level Ball Grid Array (eWLB) — high-density interconnect technologies used in mobile, IoT, and industrial electronics. They participate in large-scale European pilot line consortia, contributing specialized packaging process know-how alongside foundries, equipment makers, and Tier-1 electronics manufacturers. Based near the Paris-Saclay technology hub, they operate in the industrial segment of the semiconductor value chain rather than in academic research.

What they specialise in

How they've shifted over time

Their H2020 participation opens with InForMed (2015), a broad micro-fabrication project for medical devices where no specific packaging keywords were recorded — suggesting a generalist or supporting role in precision manufacturing. By 2017, EuroPAT-MASIP sharpens the picture dramatically: all four recorded keywords (packaging, SiP, FOWLP, eWLB) are highly specific semiconductor packaging terms, indicating a clear narrowing toward their core commercial niche. The trajectory points from applied micro-fabrication broadly to advanced semiconductor packaging specifically — a natural deepening rather than a pivot.

PACKAGING SIP is consolidating around high-density semiconductor packaging (SiP, FOWLP, eWLB), which aligns with strong industry demand from IoT, automotive, and wearables — a future collaborator can expect a focused, commercially-driven packaging specialist rather than a broad research partner.

How they like to work

PACKAGING SIP has participated in every H2020 project as a consortium member, never as coordinator — consistent with an SME that contributes specialist process expertise rather than driving project management. Both projects were large ECSEL-type or IA consortia, giving them experience operating within 20-40+ partner structures across multiple countries. This suggests they are pragmatic consortium players: comfortable in complex multi-partner settings but unlikely to anchor or lead a project independently.

Despite only two projects, PACKAGING SIP has accumulated 62 unique consortium partners across 13 countries — unusually broad exposure for a two-project SME, driven by the large pan-European ECSEL consortia they joined. Their network spans the core European semiconductor manufacturing belt (France, Germany, Belgium, Netherlands likely prominent).

What sets them apart

PACKAGING SIP's name is a direct signal of specialization — rare for an SME to brand itself around a single packaging format, which suggests this is their core commercial identity, not a peripheral capability. Located near Paris-Saclay, one of Europe's most concentrated deep-tech ecosystems, they are positioned to bridge academic research outputs and industrial-scale semiconductor packaging processes. For a consortium needing a dedicated SiP or FOWLP packaging voice without the overhead of a large industrial partner, this SME fills a specific and hard-to-substitute slot.

Highlights from their portfolio

• EuroPAT-MASIP
  Their largest project by EC funding (EUR 61,562) and the one that defines their identity — a European-scale pilot line for advanced System-in-Package manufacturing, directly aligned with their company name and core keywords.
• InForMed
  Their earliest H2020 project, notable for crossing into medical device micro-fabrication and demonstrating that their precision manufacturing capabilities extend beyond pure electronics packaging.