NXP SEMICONDUCTORS FRANCE

Their core work

NXP Semiconductors France is the French R&D arm of NXP, a major global semiconductor company. They design and develop integrated circuits, sensor systems, and advanced packaging technologies for automotive, industrial, and IoT applications. Within EU projects, they contribute semiconductor expertise to battery management systems (BMS), ultrasound sensor integration, system-in-package (SiP) manufacturing, and safety-critical verification for automated systems. Their work bridges chip-level engineering with system-level challenges in electric vehicles and smart sensing.

What they specialise in

How they've shifted over time

From 2015 to 2018, NXP France focused on core semiconductor topics: advanced packaging (SiP, fan-out wafer-level packaging), chip-to-chip communication, and integrated sensors. Starting in 2020, their focus shifted decisively toward electric vehicle batteries — BMS design, internal battery sensing, degradation monitoring, and safety. This pivot from chip packaging to battery electronics reflects the automotive semiconductor industry's broader realignment toward electrification.

NXP France is deepening its position in battery electronics for electric vehicles, making them a strong partner for future EV sensing, BMS, and battery safety projects.

How they like to work

NXP France participates exclusively as a partner, never as coordinator — consistent with large companies contributing specialized expertise to consortia led by others. With 135 unique partners across 18 countries in just 7 projects, they operate in large, multi-partner consortia typical of ECSEL and RIA calls. Their broad partner network suggests they are sought after for their semiconductor capabilities rather than building tight recurring partnerships.

NXP France has collaborated with 135 distinct partners across 18 countries, giving them one of the wider networks relative to their project count. This reach spans most of industrial Europe, reflecting participation in large ECSEL-type consortia with 20+ partners each.

What sets them apart

NXP France brings the resources and semiconductor design capabilities of a global chip leader into EU collaborative research, which few other French participants can match at this scale. Their specific combination of IC design, advanced packaging, and battery sensing makes them uniquely positioned at the intersection of semiconductor technology and EV electrification. For consortium builders, they offer industrial-grade chip and sensor expertise with a clear path to product integration and manufacturing scale.

Highlights from their portfolio

• 3beLiEVe
  Largest funding (EUR 508,800) and targets next-generation LNMO battery cells for the 2025+ EV market — directly tied to NXP's BMS sensing capabilities.
• EuroPAT-MASIP
  A European pilot line for advanced system-in-package manufacturing, positioning NXP in the EU's semiconductor sovereignty agenda.
• VALU3S
  Addresses safety verification for automated systems — connects NXP's automotive chip work with the regulatory demands of autonomous driving.