Core focus across VEGAS, OPERA, DUROC, and HERMES — all centered on designing, qualifying, and validating rad-hard FPGAs for space.
NANOXPLORE
French SME designing radiation-hardened FPGAs and programmable SoCs for European space and aviation applications.
Their core work
NanXplore is a French semiconductor SME that designs and manufactures radiation-hardened FPGAs (field-programmable gate arrays) and system-on-chip (SoC) solutions for space and aviation applications. They provide European-made programmable logic devices qualified to withstand the harsh radiation environment of space, addressing Europe's strategic need for non-dependence on non-European chip suppliers. Their work spans the full chain from silicon design through ESCC qualification to software toolchain development, making them a vertically integrated provider of space-grade programmable electronics.
What they specialise in
DUROC and HERMES focus on reprogrammable SoCs, while DAHLIA targeted rad-hard microprocessor ASICs — all for space-grade computing.
OPERA developed LGA 1752 packaging and COMAP-4S focused on System-in-Package and high pin count packaging for space EEE components.
MNEMOSYNE explored STT-MRAM non-volatile memory with radiation hardening, 3D stacking, and FDSOI technology for space use.
VEGAS, OPERA, and HERMES all include qualification and validation of components to European Space Components Coordination standards.
How they've shifted over time
In the early period (2016–2018), NanXplore focused on validating its first-generation rad-hard FPGA (VEGAS) while participating in microprocessor and ASIC design for space telecom payloads (DAHLIA), working with 28nm FDSOI technology and ARM architectures. From 2019 onward, the focus shifted decisively toward programmable, reprogrammable SoC platforms (DUROC, HERMES) and supporting technologies like advanced packaging (COMAP-4S) and radiation-hardened memory (MNEMOSYNE). The trajectory shows a company moving from component-level validation to building a complete European ecosystem of programmable space electronics with its own software tools.
NanXplore is evolving from a single-product FPGA company into a full-platform provider of programmable space computing, including SoCs, software ecosystems, and advanced packaging — positioning itself as Europe's answer to non-European semiconductor dependence.
How they like to work
NanXplore leads more often than it follows — coordinating 4 out of 7 projects, including its two largest (DUROC at EUR 2.1M and OPERA at EUR 880K). With 25 unique partners across 7 countries, they maintain a moderately broad network, though the consistent space-electronics focus suggests they work with a specialized community of space agencies, chip foundries, and system integrators. Their coordinator-heavy profile signals a company that defines technical agendas rather than simply contributing components to others' visions.
NanXplore has built a network of 25 partners across 7 European countries, reflecting the collaborative structure of Europe's space electronics supply chain. The geographic spread aligns with major European space industry hubs.
What sets them apart
NanXplore occupies a rare niche as one of the very few European companies designing and qualifying radiation-hardened FPGAs — a component class historically dominated by American suppliers. This makes them strategically important for European non-dependence in space electronics, a priority that ESA and the European Commission actively fund. For consortium builders, they bring not just chip design capability but the full qualification and software toolchain needed to actually deploy European-made programmable logic in space missions.
Highlights from their portfolio
- DUROCLargest project by funding (EUR 2.1M) and most ambitious scope — designing ultra-reprogrammable SoCs, representing the company's next-generation platform play.
- VEGASThe foundational project that validated NanXplore's first high-capacity rad-hard FPGA and software tools, establishing their market position.
- OPERADirectly builds on VEGAS with space qualification and ESCC certification of the next-generation FPGA, including new LGA packaging — critical for flight readiness.