NANOWIRED GMBH

Their core work

NanoWired develops a proprietary nanotechnology-based welding process that bonds electronic components at room temperature, targeting the electronic packaging and interconnection industry. Their core innovation eliminates the need for high-temperature soldering, which is a persistent challenge in semiconductor assembly and advanced electronics manufacturing. More recently, they have expanded into power semiconductor applications, contributing their interconnect expertise to vertical gallium nitride (GaN) device development. Based in Gernsheim, Germany, they are a technology SME commercializing deep-tech nanomaterial research.

What they specialise in

How they've shifted over time

NanoWired followed a classic deep-tech commercialization path within H2020. Their early work (2017-2021) was entirely focused on developing and scaling their room-temperature nano-welding process through the SME Instrument phases — first proving feasibility, then building toward market readiness with over EUR 2M in funding. Their most recent move (2021 onward) signals a strategic pivot into the power electronics sector, joining the YESvGaN consortium to apply their bonding expertise to GaN semiconductor manufacturing, a fast-growing market driven by electric vehicles and renewable energy conversion.

NanoWired is moving from a single-product nano-welding startup toward becoming a specialized interconnect technology supplier for the power semiconductor industry — a market with strong growth driven by electrification and energy efficiency demands.

How they like to work

NanoWired predominantly leads its own projects — two of three H2020 projects were self-coordinated through the SME Instrument, which is a solo-company funding scheme requiring no consortium. Their single consortium participation (YESvGaN) involved 27 partners across 7 countries, indicating they can integrate into large multi-partner research efforts when the fit is right. This pattern suggests a company that develops its core technology independently but selectively joins larger consortia where their niche expertise fills a specific gap.

Through YESvGaN, NanoWired connects to a 27-partner network spanning 7 European countries, likely centered on the power electronics and semiconductor research community. Their SME Instrument projects were individual efforts without consortium partners.

What sets them apart

NanoWired occupies a rare niche: room-temperature bonding technology for electronics, solving a fundamental problem in semiconductor packaging where thermal stress damages sensitive components. Their progression from SME Instrument phases to a major GaN consortium shows market validation — other research groups actively sought their technology for next-generation power devices. For consortium builders in power electronics, advanced packaging, or semiconductor manufacturing, NanoWired offers a specific, hard-to-replicate process technology rather than generic research capacity.

Highlights from their portfolio

• NanoWelds
  Secured both SME-1 and SME-2 funding (EUR 2.15M total), demonstrating strong EU confidence in the commercial viability of their room-temperature welding technology.
• YESvGaN
  Large RIA consortium tackling vertical GaN power transistors — NanoWired's inclusion signals their nano-bonding tech is considered essential for next-generation power semiconductor manufacturing.