Global semiconductor equipment leader contributing 2nm node process expertise and thin film technology to European research consortia.
Lam Research International BV is the European entity of Lam Research Corporation, a global leader in semiconductor process equipment — the machines that etch, deposit, and clean materials on silicon wafers during chip manufacturing. In H2020 projects, they bring industrial-scale process expertise and equipment capabilities to research consortia targeting the frontier of semiconductor scaling, specifically the 2nm technology node. Their thin film deposition competence also extends into adjacent energy applications, as demonstrated by participation in solid oxide cell research. As a large industrial company in this space, they function as a technology and knowledge bridge between academic research and high-volume chip manufacturing.
ID2PPAC targets the 2nm technology node, involving lithography, metrology, mask technology, and design-technology co-optimization (DTCO/STCO) — exactly Lam Research's industrial domain.
Thin film expertise appears across both projects: as a fabrication method for reversible solid oxide cells in EPISTORE and as a core process capability in semiconductor manufacturing for ID2PPAC.
ID2PPAC explicitly targets heterogeneous integration and system engineering as paths to continue performance scaling beyond traditional Moore's Law limits.
EPISTORE applies thin film and nanoionics expertise to reversible solid oxide cells for power-to-gas and power-to-power energy storage — a deliberate diversification from core semiconductor work.
Both projects launched in 2021, so the keyword contrast reflects breadth across simultaneous research threads rather than a true chronological shift. The EPISTORE project shows Lam Research exploring energy applications of their thin film capabilities — applying semiconductor deposition know-how to solid oxide cells and nanoionics. The ID2PPAC project, which received the dominant share of funding (EUR 734K vs EUR 25K), anchors their participation firmly in their core identity: advanced semiconductor process integration at the 2nm node. The funding asymmetry makes the direction clear — energy storage is a minor side-bet, while sub-2nm semiconductor manufacturing is the serious commitment.
Lam Research's H2020 engagement is overwhelmingly oriented toward next-generation semiconductor manufacturing, making them a strong prospective partner for any consortium addressing advanced chip fabrication, heterogeneous integration, or post-Moore's Law scaling strategies.
Lam Research participates exclusively as a consortium member — never as project coordinator — consistent with how large industrial equipment companies typically engage with academic-led research: contributing domain expertise and industrial validation rather than administrative leadership. With 40 unique partners across 10 countries from just 2 projects, they integrate into large, internationally diverse consortia rather than tight-knit repeated partnerships. This suggests they are brought in as a specialist anchor — an industrial player whose participation lends credibility and real-world manufacturing context to research projects.
Despite only two H2020 projects, Lam Research has connected with 40 unique consortium partners across 10 countries, reflecting the large, multi-partner structure typical of European semiconductor research programs. Their network is pan-European with a strong industrial and academic mix drawn into advanced microelectronics consortia.
Lam Research is one of the world's three dominant semiconductor equipment manufacturers — alongside ASML and Applied Materials — making their European entity an exceptionally rare industrial participant in H2020 research. Few organizations can match the combination of real fab-scale process knowledge, proprietary equipment platforms, and direct access to leading chipmaker customers that Lam Research brings to a consortium. For any project targeting advanced chip manufacturing, heterogeneous integration, or process metrology, their participation signals industrial seriousness and opens pathways to eventual technology transfer at production scale.
