SciTransfer
Organization

KLA-Tencor MIE GmbH

Semiconductor metrology and inspection equipment supplier contributing to Europe's most advanced chip fabrication pilot lines (7nm to 3nm).

Large industrial companydigitalDENo active H2020 projects
H2020 projects
3
As coordinator
0
Total EC funding
€459K
Unique partners
96
What they do

Their core work

KLA-Tencor MIE GmbH is the German subsidiary of KLA Corporation, a major global supplier of semiconductor process control, metrology, and inspection equipment. Within H2020, they contribute specialized measurement and inspection tools to large-scale European semiconductor pilot lines, supporting the manufacture of advanced chips from 7nm down to 3nm nodes. Their equipment enables quality assurance and yield optimization in both logic and power semiconductor fabrication, making them a critical equipment supplier in Europe's push for semiconductor sovereignty.

Core expertise

What they specialise in

Semiconductor metrology and inspection equipmentprimary
3 projects

All three projects (SeNaTe, R3-PowerUP, PIN3S) involve semiconductor fabrication lines where process control equipment is essential.

Advanced node semiconductor manufacturing (sub-10nm)primary
2 projects

SeNaTe targeted 7nm technology and PIN3S targeted 3nm integration, both requiring precision metrology at extreme scales.

Smart power and power electronics fabricationsecondary
1 project

R3-PowerUP focused on a 300mm pilot line for smart power and power discrete devices, where inspection tools ensure device reliability.

Nanoelectronics pilot line infrastructuresecondary
2 projects

R3-PowerUP and PIN3S both involve pilot line setups where KLA-Tencor provides equipment integration for volume production readiness.

Evolution & trajectory

How they've shifted over time

Early focus
Advanced logic node (7nm) metrology
Recent focus
3nm integration and power electronics

KLA-Tencor MIE's H2020 journey starts with advanced logic node work (7nm in SeNaTe, 2015) and broadens into power electronics (R3-PowerUP, 2017) and then pushes further to 3nm integration (PIN3S, 2019). This reflects the wider industry trend: European consortia moved from catching up on advanced logic nodes toward building domestic pilot lines for both cutting-edge logic and energy-efficient power semiconductors. Their participation tracks Europe's growing ambition in semiconductor self-sufficiency.

Moving toward the most advanced semiconductor nodes (3nm and below) while also covering the growing European power electronics sector — expect continued involvement in EU Chips Act-related pilot lines.

Collaboration profile

How they like to work

Role: specialist_contributorReach: European17 countries collaborated

KLA-Tencor MIE exclusively participates as a partner, never as coordinator — consistent with their role as a specialized equipment supplier embedded in large industry-led consortia. With 96 unique partners across 17 countries from just 3 projects, they operate within very large ECSEL-type consortia (typically 30-50 partners each). This means they are well-networked across Europe's semiconductor ecosystem but function as a technology contributor rather than a project driver.

Despite only 3 projects, KLA-Tencor MIE has worked with 96 different partners across 17 countries, a direct result of participating in massive ECSEL Joint Undertaking consortia that bring together Europe's entire semiconductor value chain — from wafer fabs to equipment makers to end users.

Why partner with them

What sets them apart

KLA-Tencor brings world-class semiconductor inspection and metrology capabilities backed by a global parent company (KLA Corporation, ~$10B revenue). Few European entities can match their depth in process control for sub-10nm manufacturing. For any consortium building a semiconductor pilot line or advanced manufacturing project, they provide the measurement backbone that determines whether chips actually work at scale.

Notable projects

Highlights from their portfolio

  • PIN3S
    Targets 3nm semiconductor integration — among the most advanced chip manufacturing projects in Europe's H2020 portfolio.
  • R3-PowerUP
    300mm pilot line for smart power devices with direct relevance to energy saving and CO2 reduction, bridging semiconductor tech and sustainability goals.
Cross-sector capabilities
Energy efficiency (power electronics for grid and automotive)Manufacturing process control and quality assuranceTransport and automotive (power semiconductors for EVs)Environment (CO2 reduction through efficient power devices)
Analysis note: Only 3 projects with limited keyword data (early-period keywords are empty). Profile is strengthened by the parent company's well-known identity in semiconductor equipment, but the specific contributions of the Weilburg subsidiary within these consortia cannot be fully determined from project data alone. No website provided for verification.