SUPERAID7 focused explicitly on stability under process variability beyond 7nm, and WAYTOGO FAST addressed advanced substrate technologies where variability modeling is critical.
Gold Standard Simulations ltd
Glasgow SME providing semiconductor device simulation and process variability modeling for advanced and sub-7nm chip technologies.
Their core work
Gold Standard Simulations is a Glasgow-based SME specializing in semiconductor device and process simulation — the computational modeling that predicts how transistors and interconnects behave at nanometer scale. They provide simulation tools and expertise for compact modeling, circuit simulation, and process variability analysis, helping chip designers understand how manufacturing variations affect performance. Their work spans advanced CMOS nodes, carbon nanotube interconnects, and embedded memory technologies, making them a specialist provider within the European semiconductor R&D ecosystem.
What they specialise in
SUPERAID7, CONNECT (carbon nanotube interconnects), and WAYTOGO FAST all required device-level and interconnect-level simulation expertise.
SUPERAID7 keywords include compact model and circuit simulation; REMINDER on embedded memory for IoT also requires compact model extraction.
REMINDER project focused on revolutionary embedded memory for IoT devices, requiring simulation of novel memory cell architectures.
CONNECT project on carbon nanotube composite interconnects represents work on post-silicon materials requiring new simulation approaches.
How they've shifted over time
Gold Standard Simulations' H2020 activity spans a narrow window (2015–2019), so evolution is modest but visible. Their earliest project (WAYTOGO FAST, 2015) dealt with fully-depleted SOI substrate architectures, while later projects shifted toward sub-7nm process variability, novel interconnect materials like carbon nanotubes, and IoT-oriented embedded memory. The trajectory suggests a move from established CMOS simulation toward modeling for emerging device architectures and beyond-silicon materials.
They are moving toward simulation of post-silicon and sub-7nm technologies, positioning them for next-generation semiconductor design challenges where process variability becomes the dominant engineering problem.
How they like to work
Gold Standard Simulations operates exclusively as a participant, never coordinating — consistent with a specialist SME that contributes deep technical expertise to larger consortia rather than managing projects. With 40 unique partners across just 4 projects, they work in large consortia (averaging 10+ partners), typical of ECSEL-IA and major ICT research initiatives. This suggests they are a trusted simulation specialist that larger semiconductor players (foundries, EDA vendors, research institutes) bring in when they need accurate device modeling.
They have collaborated with 40 unique partners across 12 countries, reflecting the broad, pan-European nature of semiconductor R&D consortia. Their network likely includes major European chip manufacturers, EDA tool companies, and semiconductor research institutes (given the ECSEL-IA involvement).
What sets them apart
Gold Standard Simulations occupies a narrow but critical niche: they are one of very few European SMEs focused specifically on semiconductor process and device simulation, sitting between the large EDA vendors and academic groups. Their ability to model process variability at advanced nodes (sub-7nm) and for emerging materials (carbon nanotubes) makes them valuable to any consortium pushing the boundaries of chip design. For consortium builders, they offer deep simulation expertise without the overhead of engaging a large EDA corporation.
Highlights from their portfolio
- SUPERAID7Their largest project by funding (EUR 382,878), directly aligned with their core simulation expertise — process variability modeling beyond the 7nm node.
- CONNECTCarbon nanotube interconnect simulation represents forward-looking work on post-copper materials, a major open challenge in semiconductor scaling.