EV GROUP E. THALLNER GMBH

Their core work

EV Group (EVG) is a leading Austrian semiconductor equipment manufacturer specializing in wafer bonding, lithography, and nanoimprint systems used in advanced chip fabrication and MEMS production. Their equipment enables heterogeneous integration, advanced packaging, and sub-nanometer alignment — critical steps in producing next-generation semiconductors, photonic devices, and sensor systems. Within H2020 projects, EVG contributes process equipment, metrology solutions, and manufacturing know-how to European pilot lines and technology demonstrators across the semiconductor value chain.

What they specialise in

How they've shifted over time

In the early period (2015–2018), EVG's H2020 work was diverse — spanning infrared detector arrays for space (ASTEROID), biomedical microfluidics (R2R Biofluidics, PHOCNOSIS), advanced packaging (EuroPAT-MASIP), and power electronics pilot lines (R3-PowerUP). From 2019 onward, the focus sharpened significantly toward advanced semiconductor manufacturing at the 2nm node (IT2, ID2PPAC), heterogeneous integration, and wide band gap power semiconductors (YESvGaN, TRANSFORM). This evolution mirrors the broader European push for semiconductor sovereignty and the strategic importance of sub-5nm process technology.

EVG is concentrating on Europe's semiconductor independence agenda — advanced node lithography, heterogeneous integration, and GaN/SiC power devices — making them a key equipment partner for future Chips Act-related initiatives.

How they like to work

EVG operates exclusively as a participant, never leading projects — consistent with their role as an equipment and process technology supplier that enables others' research and pilot production. With 331 unique consortium partners across 24 countries, they are deeply embedded in Europe's semiconductor ecosystem and comfortable in large, multi-partner consortia (many of their projects are ECSEL/IA-type with dozens of participants). This makes them a reliable, low-friction partner that integrates well into complex European supply chain projects.

EVG has collaborated with 331 unique partners across 24 countries, placing them at the center of Europe's semiconductor research network. Their partnerships span major chipmakers, research institutes (likely imec, CEA-Leti, Fraunhofer), and downstream application companies across the full EU geography.

What sets them apart

EVG occupies a critical niche as one of Europe's few independent semiconductor equipment manufacturers with capabilities in wafer bonding, nanoimprint lithography, and advanced metrology. Unlike research institutes, they bring industrial-grade production equipment directly into pilot lines, bridging the gap between lab process and volume manufacturing. For any consortium needing equipment-level process integration — from 2nm node development to MEMS sensors to power electronics — EVG is one of a handful of European companies that can deliver.

Highlights from their portfolio

• HoliFAB
  Largest single EC contribution (EUR 830K) — a microfluidic MEMS pilot providing digital-to-physical prototyping, showcasing EVG's nanofabrication infrastructure capabilities.
• IT2
  Flagship 2nm semiconductor node project positioning EVG at the frontier of European advanced chip manufacturing with lithography and metrology contributions.
• TINKER
  Second-largest funding (EUR 645K) combining additive manufacturing with sensor packaging — an unusual crossover demonstrating EVG's versatility beyond traditional semiconductor processes.