iRel40 focuses on physics of failure, robustness validation, and design for reliability at chip-package-board level; SemI40 addressed smart manufacturing of power semiconductors.
ELMOS SEMICONDUCTOR SE
German semiconductor company specializing in IC reliability engineering, advanced packaging, and Industry 4.0 manufacturing for the European electronics sector.
Their core work
Elmos Semiconductor is a German fabless semiconductor company based in Dortmund that designs and manufactures mixed-signal integrated circuits, primarily for the automotive industry. Within H2020, they contribute expertise in chip-level reliability, advanced packaging (System-in-Package, Fan-Out Wafer-Level Packaging), and the digitization of semiconductor development and manufacturing processes. Their role in EU projects centers on bringing industrial semiconductor know-how to large-scale electronics manufacturing and reliability initiatives, bridging the gap between chip design and Industry 4.0 production methods.
What they specialise in
EuroPAT-MASIP was specifically dedicated to System-in-Package assembly and Fan-Out Wafer-Level Packaging pilot manufacturing.
SemI40, iDev40, and iRel40 all address digitization, smart production, and cyber-physical systems in the European electronics and components sector.
iDev40 focused on integrated development environments using industrial internet and systems-of-systems approaches for ECS industry.
How they've shifted over time
Elmos began their H2020 participation (2016-2017) focused on smart manufacturing fundamentals — Industry 4.0 production lines, big data in factories, and advanced packaging technologies like FOWLP and eWLB. By the later period (2018-2023), their focus shifted decisively toward reliability engineering and quality prediction — physics of failure modeling, robustness validation, and AI/ML-driven reliability assessment at the chip-package-board level. This mirrors a broader industry trend: once you can manufacture advanced semiconductors, the competitive edge moves to guaranteeing their long-term reliability.
Elmos is moving from production-focused R&D toward predictive reliability and AI-assisted quality assurance for semiconductor components — a strong fit for partners working on trustworthy electronics for automotive or safety-critical applications.
How they like to work
Elmos participates exclusively as a partner, never as coordinator, which is typical for a private company contributing domain-specific industrial expertise to large research consortia. With 153 unique partners across 17 countries from just 4 projects, they operate in very large consortia (averaging ~38 partners per project). This suggests they are comfortable in large ECSEL/KDT-style joint undertaking projects where multiple industrial and academic players co-develop along the electronics value chain.
Through 4 large-consortium projects, Elmos has built connections with 153 unique partners across 17 European countries — a remarkably broad network for a mid-sized semiconductor company. Their network is concentrated in the European electronics and components ecosystem, spanning the full value chain from chip design to system integration.
What sets them apart
Elmos brings a rare combination: they are a real semiconductor manufacturer (not just a research lab) that actively participates in pre-competitive R&D on reliability and packaging. For consortium builders, this means access to actual production-grade insights on what works at the chip level, not just theoretical models. Their consistent participation in the "X 4.0" series (SemI40, iDev40, iRel40) shows deep integration into the European ECS ecosystem.
Highlights from their portfolio
- iRel40Their most recent and second-largest project (EUR 448,750), focused on intelligent reliability — represents their current strategic direction toward predictive quality in semiconductors.
- SemI40Their largest funded project (EUR 464,948) and entry point into H2020, addressing Industry 4.0 for power semiconductor manufacturing with big data and industrial internet.
- EuroPAT-MASIPSmallest funding but highly specialized — a pilot line project for advanced System-in-Package manufacturing, showing hands-on packaging capability.