L3MATRIX directly targeted large-scale silicon photonics matrices for low power, low cost data centers, and APPLAUSE included datacom transceivers in its scope.
DUSTPHOTONICS LTD
Israeli SME designing silicon photonics chips and packaging for data center transceivers, infrared sensors, and MEMS-integrated sensing applications.
Their core work
DustPhotonics is an Israeli SME specializing in silicon photonics — the technology of building optical components on standard semiconductor chips to move data at high speed using light rather than electrical signals. Their core work covers the design and manufacturing of photonic integrated circuits, with a particular focus on high-bandwidth optical transceivers for data center interconnects, where reducing power consumption and component cost are critical constraints. Beyond datacom, their photonics expertise extends into sensor applications including thermal infrared detection, gas measurement, and cardiac monitoring — all domains where silicon photonics enables compact, low-cost sensing. They operate at the intersection of semiconductor manufacturing, optics, and MEMS, which makes them relevant to any project requiring integrated photonic functionality.
What they specialise in
APPLAUSE focused specifically on low-cost manufacturing of advanced packaging for photonics, optics, and electronics — covering materials, assembly, and integration processes.
APPLAUSE keywords include thermal infrared sensor, light sensor, and gas measurement, indicating DustPhotonics contributed photonic sensing components or integration expertise.
MEMS appears as a keyword in APPLAUSE, suggesting experience combining micro-electromechanical structures with photonic components — relevant for tunable optical and sensing devices.
Cardiac monitoring appears in APPLAUSE keywords, pointing to an emerging application of their photonic sensing technology in health diagnostics.
How they've shifted over time
DustPhotonics entered H2020 with a tightly scoped focus on silicon photonics for data centers — L3MATRIX (2015–2019) was entirely about scaling photonic matrices to handle data center traffic at reduced power and cost. No keywords were recorded for that project beyond its title, suggesting their contribution was deep and specialized within a narrow domain. By the time APPLAUSE began (2019–2022), their profile had broadened substantially: the keyword set covers packaging, sensors, MEMS, biomedical, and environmental applications alongside datacom transceivers — indicating that their photonics manufacturing capability was being applied across a much wider range of end markets.
DustPhotonics appears to be expanding from a single-market photonics supplier (datacom) into a broader photonic component and packaging specialist serving health, environment, and industrial sensing — a diversification that increases their relevance to multi-sector consortia.
How they like to work
DustPhotonics has participated in two projects without taking a coordinator role in either, positioning them as a specialist technology contributor rather than a project driver. Their 38 unique partners across 14 countries — drawn from just two projects — indicates involvement in large, diverse European consortia rather than tight repeat-partner clusters. This profile is consistent with a technology SME that joins consortia to contribute specific IP or manufacturing capability and gains market exposure and validation in return.
DustPhotonics has built a surprisingly broad network for a two-project participant: 38 unique partners across 14 countries, reflecting the large multi-partner structure of both L3MATRIX and APPLAUSE. Their Israeli base within EU-funded projects places them in a specific niche of non-EU associated country participants with strong European industrial ties.
What sets them apart
DustPhotonics is one of relatively few Israeli SMEs active in EU H2020 photonics consortia, giving them a dual advantage: access to European manufacturing and packaging ecosystems while operating from Israel's strong semiconductor and photonics industry base. Their combination of silicon photonics design for high-speed datacom and demonstrated expansion into sensing (thermal, gas, cardiac) makes them useful to any consortium that needs photonic component expertise applied across both communications and sensing domains — a combination that is not common in a single SME. For a consortium builder, they represent a compact, technically focused partner with a credible track record in both fundamental photonics research (RIA) and industrial application projects (IA).
Highlights from their portfolio
- L3MATRIXThe largest of their two projects at €525,812, targeting a technically ambitious goal — scaling silicon photonics to matrix-level integration for data center use — at a time when silicon photonics for datacom was still maturing commercially.
- APPLAUSEDemonstrates DustPhotonics' pivot toward manufacturing and packaging under an Innovation Action (IA) — a market-readiness-oriented funding scheme — covering an unusually wide application range from MEMS to cardiac sensors to gas detection within a single project.