DISCO HI-TEC EUROPE GMBH

Their core work

DISCO HI-TEC Europe is the European arm of DISCO Corporation, a global leader in precision processing equipment for semiconductor wafers — dicing, grinding, and polishing systems used in chip manufacturing. In H2020 projects, they contribute specialized wafer processing capabilities to European pilot lines for power electronics, silicon carbide, and advanced photonics packaging. Their role is providing the critical manufacturing equipment and process know-how that enables European semiconductor fabrication at scale.

What they specialise in

How they've shifted over time

Their early H2020 involvement (2017-2018) centered on power electronics manufacturing — 300mm silicon smart power pilot lines and silicon carbide wafer processing, both tied to energy efficiency and CO2 reduction goals. By 2019, their focus broadened into advanced packaging for photonics, optics, MEMS, and sensor technologies (APPLAUSE), indicating a shift from pure power semiconductors toward heterogeneous integration and diverse application domains like medical devices and datacom. This mirrors an industry-wide trend where semiconductor equipment companies are expanding from traditional chip dicing into multi-material, multi-function packaging.

Moving from power semiconductor processing toward heterogeneous integration and advanced packaging for photonics, MEMS, and sensors — positioning for the growing European demand in automotive, medical, and telecom applications.

How they like to work

DISCO HI-TEC participates exclusively as a partner, never as coordinator — consistent with their role as an equipment and process provider embedded in large manufacturing consortia. With 87 unique partners across 20 countries from just 3 projects, they operate in very large consortia typical of European pilot line initiatives. This makes them an accessible partner: they are experienced in multi-partner industrial projects and accustomed to integrating their equipment contributions within complex consortium structures.

Despite only 3 projects, DISCO HI-TEC has collaborated with 87 unique partners across 20 countries, reflecting the massive scale of European semiconductor pilot line consortia. Their network spans the core European semiconductor ecosystem — fabs, research institutes, and equipment suppliers across the continent.

What sets them apart

DISCO HI-TEC brings world-class semiconductor precision processing equipment — dicing saws, grinders, polishers — that very few European companies can match. As the European subsidiary of a global market leader in wafer processing, they offer direct access to equipment and application engineering support without the complexity of engaging a Japanese headquarters. For any consortium building a European pilot line or packaging facility, DISCO is one of a handful of essential equipment partners.

Highlights from their portfolio

• REACTION
  Europe's first 8-inch silicon carbide pilot line — a strategically important project for European semiconductor sovereignty in wide-bandgap materials, and DISCO's largest single EC contribution (EUR 162,500).
• APPLAUSE
  Bridges semiconductor manufacturing into photonics, MEMS, and medical sensors — showing DISCO's equipment versatility beyond traditional power electronics applications.
• R3-PowerUP
  300mm smart power pilot line targeting energy savings and CO2 reduction — one of the flagship European power electronics manufacturing initiatives.