Both OCEAN12 and BEYOND5 are large Innovation Action consortia where Design and Reuse contributes industry reach and communication capacity to amplify results to the chip design community.
DESIGN AND REUSE
Semiconductor media platform bridging SOI/FDSOI silicon innovation with the European chip design community across automotive and RF domains.
Their core work
Design and Reuse is a French SME based in Grenoble that operates a specialized media and intelligence platform for the global semiconductor design industry, serving chip designers, EDA tool vendors, and semiconductor IP providers worldwide. Their core business is publishing technical content, design resources, and market intelligence targeting practitioners who design integrated circuits — making them a communications and dissemination node within the semiconductor ecosystem rather than an R&D lab. In H2020 projects, they function as industry outreach and dissemination partners, channeling research outcomes to an audience of engineers and designers already engaged with their platform. Their particular relevance in recent EU projects is their proximity to the FDSOI and RFSOI silicon platform communities, where they connect foundry innovations to the design teams that adopt them.
What they specialise in
FDSOI appears as a keyword in both projects, and RFSOI in BEYOND5, indicating sustained engagement with the SOI silicon platform as a consistent technical thread.
BEYOND5 (2020-2024) covers RF supply chain, millimeter-wave connectivity, V2X, IoT, and CMOS radar — all areas where Design and Reuse provides community access.
OCEAN12 (2018-2022) focused on FDSOI technology for autonomous driving at the 12nm node, connecting advanced silicon processes to automotive design requirements.
How they've shifted over time
Their H2020 participation opened in 2018 with OCEAN12, where the focus was squarely on advanced automotive applications — FDSOI at 12nm for autonomous driving, smart mobility, and the semiconductor process ecosystem supporting it. By 2020, BEYOND5 marked a deliberate expansion into the broader RF domain: 5G, millimeter-wave, V2X, IoT, and CMOS radar, all still on the SOI platform but now spanning multiple wireless verticals beyond automotive. The consistent throughline is FDSOI/SOI technology, but the application lens widened from a single vertical (automotive) to the full connected-device spectrum, tracking exactly how the European semiconductor industry evolved in that period.
Design and Reuse is tracking the semiconductor industry's convergence around SOI-based platforms for multi-domain wireless connectivity — future collaborations are most likely in 5G infrastructure, automotive radar, mmWave sensing, and IoT chip design dissemination.
How they like to work
Design and Reuse has never coordinated an H2020 project, always joining as a participant — consistent with a media and outreach role rather than a technical project lead. Both projects placed them inside very large consortia (60 unique partners across just two projects), typical of pan-European Innovation Actions in the semiconductor supply chain. For a consortium builder, they are a plug-in dissemination asset: they bring a pre-existing audience of chip designers and EDA engineers, not laboratory capacity.
Design and Reuse has touched 60 unique consortium partners across 14 countries through only two projects, which reflects the characteristically large, cross-border consortia of European semiconductor initiatives. Their network spans the full semiconductor supply chain — foundries, EDA vendors, design houses, and research institutes — mirroring the readership of their media platform.
What sets them apart
Design and Reuse occupies a role almost no other H2020 participant does: they are a media platform with a live, engaged audience of semiconductor design professionals, which means project results they disseminate actually reach the engineers who can use them. For any consortium working on advanced silicon processes, RF chip design, or FDSOI-based applications, partnering with them solves the "who reads our deliverables" problem. Their Grenoble location also places them at the heart of Europe's microelectronics corridor, close to STMicroelectronics and CEA-Leti, giving them natural proximity to the key actors in European SOI technology.
Highlights from their portfolio
- BEYOND5Their largest project by EC contribution (EUR 84,375), covering the broadest application scope — 5G, V2X, IoT, millimeter-wave, and CMOS radar — through a fully European RFSOI supply chain initiative.
- OCEAN12Their entry into EU project participation, connecting FDSOI technology at an advanced 12nm node directly to the autonomous driving design community — an unusually specific intersection of silicon process and automotive safety.