Contributor to SeNaTe (7nm node technology) and TAPES3 (3nm semiconductor pilot line), both large ECSEL/IA industrial pilot programmes.
DEMCON BUNOVA B.V.
Dutch engineering firm providing software, testing and compliance infrastructure for advanced semiconductor manufacturing and medical device regulation.
Their core work
DEMCON BUNOVA is a Dutch engineering and software firm based in Enschede, part of the wider DEMCON high-tech systems group. Their work sits at the intersection of industrial software, system engineering, and regulated product development — from semiconductor equipment control software to compliance tooling for medical devices. They are the kind of partner consortia bring in when a research prototype needs to survive contact with industrial reality: measurement, software integration, testing frameworks, and regulatory readiness.
What they specialise in
Third-party role in MDOT (Medical Device Obligations Taskforce), focused on MDR testing databases, biocompatibility and device safety networks.
Combined TAPES3 (materials/process data for advanced nodes) and MDOT (regulatory database, blockchain traceability) show recurring work on structured data platforms for regulated industries.
All three projects are large multi-partner IAs where BUNOVA plays the integration specialist connecting hardware/process partners with software and compliance workflows.
How they've shifted over time
In 2015-2018 their H2020 footprint was purely semiconductor: SeNaTe (7nm) and the follow-on TAPES3 (3nm) placed them inside Europe's advanced-node manufacturing push, working on process, equipment and materials software. From 2019 onward the profile broadens sharply into medical device regulation via MDOT — MDR compliance, biocompatibility testing databases, and blockchain-based device traceability. The shift suggests a deliberate move from pure semiconductor tooling into regulated-industry software platforms where the underlying skills (data systems, testing, compliance) transfer well.
Heading toward regulated-industry software platforms — MDR compliance, traceability, and testing databases — while retaining a foothold in semiconductor process tooling.
How they like to work
They consistently appear as a third-party contributor rather than coordinator or formal beneficiary, joining large industrial Innovation Actions alongside 78 different partners across 15 countries. This pattern points to a specialist subcontractor role: brought in by a prime beneficiary for a defined software or testing contribution, not to lead work packages. They are easy to plug into an existing consortium for a bounded technical deliverable.
A broad European network of 78 distinct partners across 15 countries, built through participation in two ECSEL semiconductor flagships and one medical device consortium. The geographic spread reflects the pan-European nature of those flagships rather than a targeted partnering strategy.
What sets them apart
Most Dutch software firms in H2020 sit in one vertical; BUNOVA bridges two very different regulated worlds — sub-10nm semiconductor manufacturing and MDR-regulated medical devices. That cross-domain software and compliance experience is rare. For a consortium that needs an integrator who already understands both equipment-side data pipelines and regulated product documentation, they are an unusually well-matched partner.
Highlights from their portfolio
- TAPES3Major ECSEL-IA pilot line for 3nm semiconductor technology — one of Europe's most strategic advanced-manufacturing programmes.
- MDOTMarks their pivot from semiconductors into medical device regulation, combining MDR, biocompatibility testing and blockchain traceability in one project.
- SeNaTeTheir entry point into H2020, on 7nm node technology, establishing the semiconductor track record that led into TAPES3.