CAPRES AS

Their core work

CAPRES AS is a Danish technology SME specializing in advanced metrology instrumentation and measurement techniques for semiconductor and electronics manufacturing. Their work centers on characterizing 3D device structures using a suite of high-precision tools: Time-of-Flight Secondary Ion Mass Spectrometry (TOFSIMS) for materials composition analysis, Micro-Hall probes for electrical property mapping, and GHz Scanning Acoustic Microscopy for non-destructive structural inspection. In both H2020 projects they joined large ECSEL consortia as a specialist contributor, providing measurement expertise that supports the development and validation of next-generation 3D electronic components. Their commercial value lies in delivering quantitative, traceable measurements at scales and geometries that standard lab equipment cannot reach.

What they specialise in

How they've shifted over time

Both H2020 projects ran concurrently (2016–2019) and all keyword signals come from the first project (METRO4-3D), while the second (3DAM) carries no keywords in the dataset — so a true temporal shift cannot be established from this data alone. What the evidence does show is a consistent, focused position in 3D metrology for semiconductor electronics throughout the mid-to-late 2010s, with no observable pivot to adjacent areas. Without projects beyond 2019, it is not possible to say whether this focus has deepened, broadened, or contracted since their ECSEL participation ended.

Within their H2020 window they stayed tightly focused on 3D metrology for electronics; whether they have since expanded into photonics, MEMS, or power device inspection cannot be confirmed from this data.

How they like to work

CAPRES AS has participated exclusively as a consortium partner — never as a project coordinator — across both H2020 projects, both of which were large ECSEL initiatives involving many industrial and research actors. This pattern is typical of specialist equipment or service providers who contribute a defined measurement capability to broader R&D programmes rather than driving the research agenda themselves. Working with them likely means engaging a well-scoped, technically focused partner rather than a generalist integrator.

CAPRES AS has built connections with 24 unique partners across 11 countries through just two projects, which is a notably broad network for an SME with a narrow technical focus — typical of large ECSEL consortia that bring together pan-European supply chains. Their geographic spread suggests comfort working in multinational settings despite their small size.

What sets them apart

CAPRES AS occupies a narrow but high-value niche: they provide specialist metrology tools and techniques that semiconductor and advanced electronics projects need but rarely have in-house. Their specific combination of TOFSIMS, Micro-Hall, and GHz acoustic microscopy makes them relevant to any consortium working on 3D integration, advanced packaging, or novel semiconductor materials where standard characterisation methods fall short. For a consortium builder, they bring credible industrial metrology credibility without competing for the scientific or system-integration leadership roles.

Highlights from their portfolio

• METRO4-3D
  The larger of the two projects (EUR 301,875 in EC funding) and the only one with substantive keyword data, making it the primary evidence base for CAPRES's technical profile in 3D metrology.
• 3DAM
  Extends the metrology focus explicitly to advanced materials for devices, suggesting CAPRES's measurement expertise spans both geometric/structural and materials-level characterisation.