Core capability across all projects, explicitly featured in NanoQI with X-ray diffraction analysis and reflectometry keywords.
BRUKER AXS GMBH
Manufacturer of X-ray diffraction and reflectometry instruments, providing advanced metrology for semiconductor and thin-film materials characterization.
Their core work
Bruker AXS is the X-ray analysis division of the Bruker Corporation, manufacturing advanced analytical instruments for materials characterization — particularly X-ray diffraction (XRD), X-ray reflectometry, and hyperspectral imaging systems. In H2020, they contributed metrology and inspection tools to Europe's semiconductor research programs, helping consortia characterize thin films, crystal structures, and surface defects at the nanometer scale. Their instruments are essential infrastructure for anyone developing next-generation semiconductor processes or advanced nano-materials.
What they specialise in
Provided metrology tools in SeNaTe (7nm), WAYTOGO FAST, 3DAM (3D Advanced Metrology), and TAKE5 (5nm) — all ECSEL semiconductor programs.
NanoQI focused specifically on thin-film nano-material evaluation including crystallinity, crystal orientation, and surface roughness measurement.
NanoQI introduced hyperspectral imaging and surface defect imaging as new capabilities beyond traditional X-ray methods.
How they've shifted over time
Their early H2020 involvement (2015–2019) centered on supplying metrology tools to large semiconductor node-shrink programs — the 7nm and 5nm technology generations — where they operated as a third-party equipment provider. Their most recent project, NanoQI (2020–2023), marks a shift: they joined as a full participant with significant funding (EUR 1.47M) and expanded into hyperspectral imaging and multimodal quality assessment for thin-film nano-materials. This suggests a move from passive tool supplier toward active R&D partner developing next-generation inspection methods.
Moving from X-ray-only semiconductor metrology toward multimodal imaging (X-ray + hyperspectral) for broader materials quality assessment — expect growing capability in inline inspection and non-destructive evaluation.
How they like to work
Bruker AXS typically joins large ECSEL consortia (averaging 18+ partners per project) as a third-party equipment and metrology provider rather than leading projects. Their shift to full participant status in NanoQI with substantial funding signals increasing willingness to co-develop rather than just supply instruments. With 90 unique partners across 18 countries, they are well-connected but appear to follow the consortium rather than build it — a reliable specialist contributor you bring in when you need advanced characterization capabilities.
Connected to 90 unique partners across 18 countries, almost entirely through large ECSEL semiconductor consortia. Their network is concentrated in Europe's semiconductor ecosystem — research institutes, foundries, and equipment suppliers primarily in Germany, France, Belgium, and the Netherlands.
What sets them apart
Bruker AXS brings world-class X-ray analytical instrumentation to consortium projects — they are not a research group studying X-ray techniques, but the company that builds and sells the machines. This means partners get access to prototype instruments and application expertise directly from the manufacturer. For any project requiring advanced materials characterization, crystallographic analysis, or thin-film metrology, they offer a direct line from research results to commercially available measurement tools.
Highlights from their portfolio
- NanoQITheir largest funded project (EUR 1.47M) and a strategic pivot — combining X-ray with hyperspectral imaging for multimodal thin-film quality assessment, moving beyond traditional metrology.
- 3DAMDirectly focused on '3D Advanced Metrology' for next-gen semiconductor devices, aligning perfectly with Bruker AXS's core instrument business.
- SeNaTePart of the 7nm semiconductor technology push — one of Europe's flagship programs to maintain competitiveness in advanced chip manufacturing.