BOSCHMAN TECHNOLOGIES BV

Their core work

Boschman Technologies is a Dutch SME specializing in semiconductor packaging equipment and processes, particularly sintering and die attach technologies. They develop advanced packaging solutions for microelectronics, optoelectronics, and power semiconductors, serving industries from automotive to medical devices. Their core business revolves around providing manufacturing equipment and process know-how for assembling and interconnecting electronic components — the critical step that turns bare chips into functional devices.

What they specialise in

How they've shifted over time

Early H2020 work (2015-2017) centered on pilot line manufacturing for sensors and medical devices — broad semiconductor fabrication covering both frontend and backend processes. From 2018 onward, focus narrowed sharply toward packaging-specific challenges: sintering, die attach, in-line inspection of packaged components, and advanced packaging for photonics and power electronics. This shift suggests Boschman doubled down on their core competence — the packaging step — rather than staying in general semiconductor manufacturing.

Moving toward quality assurance and inspection of packaging processes, combined with expanding into power electronics and photonics packaging — positioning themselves at the intersection of packaging technology and Industry 4.0 manufacturing control.

How they like to work

Boschman consistently participates as a specialist partner rather than leading projects, reflecting their role as an equipment and process provider within larger value chains. With 127 unique partners across 16 countries, they operate in large ECSEL-type consortia (typically 20+ partners), which is standard for European electronics pilot line projects. This broad network makes them well-connected across the European semiconductor ecosystem, though they contribute specialized packaging expertise rather than driving project direction.

Extensive network of 127 partners across 16 countries, built through large ECSEL electronics industry consortia. Their reach spans the major European semiconductor hubs including likely connections to organizations in Germany, France, Austria, and Belgium.

What sets them apart

Boschman occupies a specific niche: they are one of few European SMEs focused on semiconductor packaging equipment, particularly sintering-based die attach. While large players dominate frontend semiconductor fabrication, Boschman brings deep backend packaging expertise that is critical for power electronics, sensors, and photonics. For consortium builders, they fill the packaging and assembly gap that many consortia need but struggle to source from a flexible, European-based SME.

Highlights from their portfolio

• HIOS
  Largest single EC contribution (EUR 489,825) — focused on highly integrated optoelectronic sensors, suggesting significant packaging innovation work.
• INLINETEST
  Most technically specific to their core business — directly addresses quality inspection of sintered die attach joints using infrared thermography.
• Power2Power
  Their most recent funded project (2019-2022), signaling expansion into power semiconductor packaging for electric mobility and grid applications.