BESI AUSTRIA GMBH

Their core work

BESI Austria is the Austrian arm of BE Semiconductor Industries, a global leader in semiconductor assembly and packaging equipment. Within H2020, they contribute advanced packaging technologies — including system-in-package (SiP), fan-out wafer-level packaging (FOWLP), and additive manufacturing-enabled sensor packaging — to European pilot lines and manufacturing platforms. Their practical role is bridging the gap between chip design and final packaged product, enabling compact, reliable semiconductor modules for power electronics, photonics, medical devices, and industrial sensors.

What they specialise in

How they've shifted over time

BESI's early H2020 work (2015–2018) focused squarely on power semiconductor packaging — GaN components, smart power pilot lines, and established packaging formats like FOWLP and eWLB. From 2019 onward, their portfolio diversified significantly into application-driven packaging: photonics for medical monitoring, harsh-environment IoT sensors, additive manufacturing for sensor packages, and even quantum computing materials. The trajectory shows a company moving from pure power electronics packaging toward becoming a broad-spectrum advanced packaging provider for emerging technology domains.

BESI is expanding from its power electronics base into packaging for medical, quantum, and industrial IoT applications — expect them to pursue projects where advanced packaging is the enabling technology for new product categories.

How they like to work

BESI operates exclusively as a participant, never as coordinator — consistent with a large industrial company contributing specialized manufacturing capability to consortia led by research institutes or integrators. With 209 unique partners across 22 countries, they are a high-connectivity node rather than a loyalty-driven repeat partner, which means they adapt well to new consortium configurations. Their role is typically that of an industrial end-user or pilot line operator who validates and manufactures what the consortium designs.

Extensive European network spanning 209 unique partners across 22 countries, built through participation in large-scale pilot line projects (typically 30-50 partner consortia). Strong ties to the European semiconductor ecosystem including major pilot line initiatives.

What sets them apart

BESI brings industrial-scale semiconductor packaging and assembly equipment expertise that few European partners can match — they are not a research lab prototyping packages, but a production-grade equipment and process provider. Their participation across GaN power, photonics, MEMS, medical, and quantum projects makes them uniquely versatile: they can package almost anything at the chip-to-system level. For consortium builders, BESI provides the critical manufacturing validation step that turns research results into producible components.

Highlights from their portfolio

• TINKER
  Largest single EC contribution (EUR 1.06M) — focused on additive manufacturing for sensor packages, representing a significant bet on next-generation packaging methods.
• APPLAUSE
  Broadest application scope: photonics, optics, MEMS, cardiac monitoring, and gas measurement packaging in a single project, showcasing BESI's cross-domain packaging versatility.
• MATQu
  Most forward-looking project — materials for quantum computing signals BESI's ambition to be relevant in post-classical computing hardware manufacturing.