ATEP - AMKOR TECHNOLOGY PORTUGAL SA

Their core work

ATEP (Amkor Technology Portugal, formerly NANIUM) is a semiconductor packaging and test facility specializing in advanced wafer-level packaging technologies such as Fan-Out Wafer-Level Ball Grid Array (eWLB) and System-in-Package (SiP). They provide manufacturing services for RF and power semiconductor components, serving the electronics and telecommunications industries. As part of global packaging leader Amkor Technology, their Portuguese site brings pilot-line and volume manufacturing capabilities to European R&D consortia working on next-generation chip packaging and integration.

What they specialise in

How they've shifted over time

ATEP's H2020 trajectory shows a clear progression from component-level work toward system integration and smart manufacturing. Their earliest involvement (2015) focused on RF substrate materials, a foundational technology. By 2016-2017, they had moved into Industry 4.0 digitalization of semiconductor fabs and then took the lead on advanced multi-chip packaging — a higher-value, more integrative capability where they became a coordinator rather than just a participant.

ATEP is moving up the value chain from individual component processing toward integrated multi-chip packaging solutions, positioning them as a European pilot-line partner for advanced SiP and FOWLP technologies.

How they like to work

ATEP operates primarily as a participant but stepped into a coordinator role for their most recent and largest project (EuroPAT-MASIP, EUR 285K). With 74 unique partners across 11 countries from just 3 projects, they work in large European consortia — typical for Innovation Actions in the semiconductor domain. Their willingness to coordinate suggests growing confidence in leading collaborative R&D, not just contributing manufacturing capacity.

Despite only 3 projects, ATEP has built connections with 74 distinct partners across 11 countries, reflecting involvement in large-scale semiconductor industry consortia. Their network spans the European microelectronics ecosystem from research institutes to major chip manufacturers.

What sets them apart

ATEP is one of very few European facilities offering advanced Fan-Out Wafer-Level Packaging (FOWLP) and eWLB manufacturing at pilot and production scale. Backed by Amkor Technology's global resources, they provide a rare combination of industrial-grade packaging capabilities with the flexibility to participate in collaborative R&D. For any consortium needing a manufacturing partner to take packaging concepts from prototype to production on European soil, ATEP fills a gap that most academic clean rooms cannot.

Highlights from their portfolio

• EuroPAT-MASIP
  Their only coordinator role and largest funding (EUR 285K), focused on establishing a European pilot line for advanced System-in-Package — directly aligned with their core business.
• SemI40
  A major Industry 4.0 initiative for power semiconductor manufacturing involving a large consortium, connecting ATEP to the smart factory and digitalization community.