Core contributor across GaNonCMOS, UltimateGaN, iRel40, CHARM, DRAGON, and HiEFFICIENT — all requiring chip-package-board integration and advanced packaging.
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Austrian PCB and IC substrate manufacturer specializing in advanced packaging for GaN power electronics, 5G RF systems, and reliable chip-package-board integration.
Their core work
AT&S is one of Europe's leading manufacturers of advanced printed circuit boards (PCBs) and IC substrates, headquartered in Leoben, Austria. Their core industrial expertise lies in high-density interconnect technologies, chip-package-board integration, and packaging solutions for semiconductors and power electronics. In H2020 projects, they contribute manufacturing know-how for embedding components, ensuring reliability of electronic assemblies, and developing packaging for GaN power devices and mmWave RF systems. Their work spans from sustainable electronics lifecycles to next-generation 5G and smart mobility power systems.
What they specialise in
GaNonCMOS, UltimateGaN, and HiEFFICIENT all focus on gallium nitride device integration where AT&S provides substrate and packaging expertise.
iRel40 (Intelligent Reliability 4.0) and CHARM (harsh environment tolerant systems) both address design-for-reliability and robustness validation of electronic assemblies.
DRAGON project targets D-band radio and antenna array integration for 5G backhauling, requiring high-frequency PCB substrates.
SemI40 (semiconductor manufacturing 4.0) and sustainablySMART (remanufacturing and disassembly automation) address digital manufacturing processes.
sustainablySMART focused on remanufacturing and modularity for mobile devices; ReWaCEM addressed industrial wastewater treatment, suggesting interest in environmental footprint of electronics manufacturing.
How they've shifted over time
In their early H2020 period (2015–2017), AT&S focused on sustainable electronics lifecycles, smart device remanufacturing, semiconductor manufacturing digitalization, and industrial wastewater recovery — a broad spread reflecting exploratory engagement. From 2019 onward, their participation sharpened dramatically toward GaN power electronics, chip-package-board reliability, 5G/mmWave RF systems, and smart mobility — all centered on their core competence in advanced packaging and substrates. The trajectory shows a company that moved from general Industry 4.0 participation to deep specialization in next-generation power and RF electronics packaging.
AT&S is concentrating on packaging solutions for wide-bandgap semiconductors (GaN) and high-frequency RF systems, positioning them at the intersection of 5G infrastructure, electric mobility, and smart grid applications.
How they like to work
AT&S participates exclusively as a partner — never as coordinator — reflecting a large industrial company that contributes specialized manufacturing capability to research-driven consortia rather than leading them. With 223 unique partners across 21 countries in just 9 projects, they operate in large consortia (averaging ~25 partners per project), typical of ECSEL/KDT-style electronics initiatives. This broad network suggests they are a sought-after industrial partner valued for their real-world production expertise.
AT&S has built an extensive European network of 223 unique partners across 21 countries through 9 projects, primarily within the semiconductor and electronics ecosystem. Their partnerships span major European electronics hubs including Germany, France, Netherlands, and the Nordic countries, with strong ties to both research institutions and fellow industrial players.
What sets them apart
AT&S is one of the few European companies with world-class capability in advanced PCB substrates and IC packaging — a strategic competence as Europe pushes for semiconductor sovereignty. Unlike research institutes that study packaging in theory, AT&S brings actual high-volume manufacturing infrastructure and process know-how to consortia. For any project needing to go from chip design to a working packaged system, AT&S offers the bridge between semiconductor R&D and industrial-scale production.
Highlights from their portfolio
- sustainablySMARTLargest single EC contribution (EUR 801K) and their earliest H2020 project — focused on sustainable mobile device lifecycles, an unusual topic for a PCB manufacturer showing breadth.
- UltimateGaNCentral to the European GaN ecosystem addressing 5G, smart grid, and smart mobility — a technology area where AT&S is increasingly concentrating.
- iRel40Directly addresses Quality 4.0 and physics-of-failure prediction for electronics reliability — core to AT&S's value proposition as a packaging company.