Central to Mont-Blanc 3, Mont-Blanc 2020, ExaNoDe, EuroEXA, ExaNeSt, NEXTGenIO, Sage, Sage2, ComPat, and ESiWACE — all targeting exascale or pre-exascale computing.
ARM LIMITED
Global processor architecture leader contributing energy-efficient chip designs to European exascale computing and embedded systems research.
Their core work
ARM is the world's leading designer of energy-efficient processor architectures, whose chip designs power the vast majority of mobile devices and an increasing share of servers and embedded systems. In H2020, ARM contributed its deep expertise in low-power processor design, memory architectures, and system-on-chip engineering to Europe's push toward exascale computing. They bring industrial-grade silicon design capability to research consortia, helping translate academic HPC concepts into viable, power-efficient hardware platforms. Their work spans from space-grade triple-core lockstep processors to AI inference platforms and next-generation data centre microservers.
What they specialise in
Keywords across Mont-Blanc 3, ExaNoDe, M2DC, EuroEXA explicitly focus on energy efficiency, low-power processors, and power-efficient platforms.
M2DC, UniServer, HiPEAC (3 editions), and Mont-Blanc 3 address embedded computing, microserver datacentres, and cyber-physical systems.
MNEMOSENE explores resistive-device computation-in-memory, NEXTGenIO targets non-volatile memory I/O, and ExaNoDe investigates memory node design.
Bonseyes (2016-2020) focused on an open AI development platform, signalling ARM's move into dedicated AI inference hardware.
TCLS ARM FOR SPACE defined a triple-core lockstep ARM system-on-chip for space applications, extending ARM's architecture to radiation-hardened environments.
How they've shifted over time
ARM's early H2020 work (2015-2017) concentrated heavily on exascale computing fundamentals — low-power processors, memory hierarchies, accelerators, MPI runtime systems, and raw HPC performance. In the later period (2017-2022), the focus shifted toward co-design methodologies, computer architecture at a systems level, cyber-physical systems, and materials science applications of HPC. This evolution reflects a move from building the hardware building blocks toward integrating them into application-driven, co-designed computing platforms.
ARM is moving from component-level HPC contributions toward full-stack co-design of computing systems tailored to specific application domains like materials science and AI.
How they like to work
ARM participates exclusively as a consortium partner — they have never coordinated an H2020 project, which is typical for large industry players contributing specific technical expertise rather than driving the research agenda. With 138 unique partners across 19 countries, they maintain an exceptionally broad network, rarely appearing in the same consortium twice. This makes them a high-value but non-captive partner: they bring world-class IP and engineering, contribute to well-defined technical work packages, and move on.
ARM has collaborated with 138 unique partners across 19 countries, forming one of the widest industrial partner networks in European HPC research. Their partnerships span leading European supercomputing centres, semiconductor companies, and major research universities.
What sets them apart
ARM is the only global processor architecture company participating at this scale in European HPC research — no other chip designer brings comparable commercial reach to EU consortia. Their involvement signals that a project's hardware concepts have genuine commercial viability, not just academic interest. For consortium builders, ARM adds immediate industrial credibility and a path from prototype to product through their massive licensee ecosystem.
Highlights from their portfolio
- Mont-Blanc 3Largest single EC contribution to ARM (EUR 1.28M) — flagship project designing a European HPC platform based on ARM's low-power embedded technology.
- BonseyesARM's only AI-focused H2020 project (EUR 717K), building an open platform for AI system development — a strategic pivot from pure HPC.
- TCLS ARM FOR SPACEUnique crossover into space-grade computing, designing a triple-core lockstep ARM chip for radiation-hardened space applications.