Core contributor across the full node progression: SeNaTe (7nm), TAKEMI5 (5nm), TAPES3 (3nm), PIN3S (3nm pilot), and IT2 (2nm).
APPLIED MATERIALS BELGIUM
European R&D arm of the global semiconductor equipment leader, contributing process tools and materials expertise from 7nm to 2nm nodes and into silicon photonics.
Their core work
Applied Materials Belgium is the European arm of the world's largest semiconductor equipment manufacturer, based in Leuven near IMEC. They develop and supply process equipment, metrology tools, and advanced materials for chip fabrication at the most advanced technology nodes (7nm down to 2nm). Their H2020 participation focuses on enabling next-generation semiconductor manufacturing through equipment innovation, lithography, and deposition technologies. More recently, they have expanded into silicon photonics components for optical communication.
What they specialise in
Keywords across TAKEMI5, TAPES3, PIN3S, and IT2 consistently reference metrology, materials, and equipment development for sub-10nm nodes.
SIPHO-G (2021-2025) targets GeSi-based modulators, photodetectors, and optical transceivers — a clear diversification beyond traditional CMOS.
Productive4.0 addressed process automation, simulation, and supply chain management for electronics manufacturing.
How they've shifted over time
In the early period (2015-2018), Applied Materials Belgium combined core semiconductor equipment work with broader digital manufacturing themes like smart production, process automation, and supply chain management (Productive4.0). From 2019 onward, their focus sharpened almost exclusively on advancing semiconductor process technology at ever-smaller nodes (3nm, 2nm), with deep involvement in lithography, metrology, and DTCO/STCO. Their most recent project (SIPHO-G, 2021) signals a strategic expansion into silicon photonics, suggesting the company is positioning for the convergence of electronics and photonic integration.
Moving toward heterogeneous integration and silicon photonics alongside continued push to the 2nm node and beyond — expect future interest in chiplet architectures and optical interconnects.
How they like to work
Applied Materials Belgium participates exclusively as a partner, never as coordinator — consistent with a large industrial player contributing specialized equipment expertise to consortium-driven R&D. They operate in very large consortia (206 unique partners across 7 projects, averaging ~30 partners per project), typical of ECSEL Joint Undertaking projects. Their relatively modest EU funding (avg ~EUR 160K per project) relative to their corporate scale suggests they contribute substantial in-kind resources and proprietary know-how beyond the grant amount.
Extensive European network spanning 206 unique partners across 25 countries, built through large ECSEL-type semiconductor consortia. Their Leuven base places them at the heart of Europe's semiconductor ecosystem alongside IMEC and other major players in the Belgian-Dutch-German semiconductor corridor.
What sets them apart
Applied Materials Belgium brings world-leading semiconductor equipment and materials expertise from a global industry leader directly into European R&D consortia. Their unbroken track record across every major node milestone from 7nm to 2nm makes them one of very few organizations that can provide continuity across the full advanced semiconductor roadmap. For consortium builders, they offer immediate credibility, access to industrial-grade process tools, and a bridge between European research and high-volume manufacturing.
Highlights from their portfolio
- SeNaTeLargest funding (EUR 518K) — the 7nm node project that started their continuous participation across every subsequent semiconductor technology generation.
- IT2Addresses the 2nm node with the broadest technical scope: lithography, metrology, DTCO, STCO, heterogeneous integration, and photonics — a roadmap for the future of chip manufacturing.
- SIPHO-GStrategic pivot into silicon photonics (GeSi components, optical transceivers) — signals diversification beyond traditional CMOS into photonic-electronic convergence.