Both MASSTART and APPLAUSE directly center on advanced packaging and assembly of photonic devices, ranging from silicon photonics transceivers to multi-sensor modules.
ALMAE TECHNOLOGIES
French photonics packaging specialist: assembly, integration, and volume manufacturing of silicon photonics transceivers, sensors, and MEMS modules.
Their core work
Almae Technologies is a French photonics manufacturing company specializing in the packaging, assembly, and testing of photonic and optoelectronic components. Their core industrial capability is the high-precision integration of photonic chips — including silicon photonics dies, MEMS devices, and optical elements — into finished modules ready for deployment. In the MASSTART project they contributed to mass-manufacturable transceiver assembly for terabit-scale data center interconnects, while in APPLAUSE they applied similar packaging expertise across a broader range of photonic products including light sensors, thermal infrared sensors, and gas measurement devices. They function as a manufacturing and integration specialist rather than a chip designer, sitting at the critical bridge between laboratory photonics and volume production.
What they specialise in
MASSTART (2019–2023) targeted mass manufacturing of silicon photonics-based transceivers for terabit-per-second data center interconnects, including pigtailing and automated testing.
APPLAUSE (2019–2022) extended their packaging expertise to light sensors, thermal infrared sensors, MEMS, cardiac monitoring, and gas measurement — demonstrating vertical breadth.
Automation, testing, and process control appear as explicit keywords across both projects, indicating industrial process engineering as a core competence alongside the photonics itself.
APPLAUSE explicitly covers electronics packaging in conjunction with photonics and optics, suggesting capability in co-packaging of electronic and photonic components.
How they've shifted over time
Both H2020 projects launched in 2019, so temporal evolution is limited — but the two projects reveal a clear application broadening within the same period. Their first project, MASSTART, is tightly focused on a single industrial vertical: silicon photonics transceivers for data center interconnects, with keywords dominated by telecom-grade packaging, pigtailing, and automated testing. Their second project, APPLAUSE, uses the same packaging and assembly core but opens it to a much wider range of end markets — thermal infrared sensing, cardiac monitoring, gas measurement, and MEMS — signaling a deliberate move from single-vertical specialization to platform-style photonics manufacturing. The trend suggests Almae Technologies is positioning its manufacturing process expertise as sector-agnostic, applicable wherever photonic integration meets volume production requirements.
Almae Technologies is expanding from a single-market photonics packager (data centers) toward a generalist photonic integration house serving health, environment, and industrial sensing markets.
How they like to work
Almae Technologies has participated exclusively as a consortium partner — never as project coordinator — across both H2020 projects. Despite their small project count, they have accumulated 38 unique consortium partners across 12 countries, suggesting they bring a well-defined specialist capability that larger consortia recruit for rather than build in-house. This profile is typical of an industrial manufacturing partner that joins projects to contribute a specific process step (packaging, assembly, testing) and validate it at scale, rather than to lead research agendas.
Despite only two projects, Almae Technologies has built a notably wide network of 38 unique partners spanning 12 countries — an average of 19 partners per project — indicating participation in large, multi-partner Innovation Actions typical of ICT manufacturing consortia. No geographic concentration is identifiable from available data beyond their French base.
What sets them apart
Almae Technologies occupies a rare niche as an industrial-scale photonics packaging and integration house in France — a role that sits between chip foundries (which make the photonic dies) and system integrators (which deploy finished products). Their dual participation in MASSTART and APPLAUSE demonstrates that their packaging processes are application-agnostic, making them a reusable manufacturing asset for any consortium that needs photonic components to move from prototype to manufacturable module. For consortium builders, this means Almae brings immediate industrial relevance to TRL 6–8 Innovation Actions without requiring basic research from the project budget.
Highlights from their portfolio
- APPLAUSEHighest-funded project (EUR 503,125) and most diverse in application scope — spanning health (cardiac monitoring), environment (gas measurement), and industrial sensing within a single photonics packaging framework.
- MASSTARTLongest project duration (2019–2023) targeting a commercially critical bottleneck — mass-manufacturing silicon photonics transceivers for terabit-scale data centers — with direct industry relevance to hyperscaler infrastructure.