Dutch SME specializing in advanced electronics packaging, assembly, and interconnect for semiconductors, sensors, and photonic components.
Advanced Packaging Center (APC) is a Dutch SME specializing in electronics packaging, assembly, and interconnect technologies for semiconductor components. They provide packaging solutions for sensors, optoelectronics, power semiconductors, and MEMS devices — the critical step that turns bare chips into functional, reliable products. Their work spans frontend and backend semiconductor manufacturing processes, including advanced techniques like sintering and die attach, serving the European microelectronics and nanoelectronics supply chain.
Core contributor across APPLAUSE (photonics/optics packaging), INLINETEST (micro/nanoelectronics packaging), HIOS (optoelectronic sensor integration), and IoSense (sensor pilot line frontend/backend).
Participated in IoSense (FE/BE sensor pilot line), R3-PowerUP (300mm smart power pilot line), and Power2Power (next-gen silicon power solutions).
Contributed to R3-PowerUP (smart power and power discretes) and Power2Power (power semiconductors for mobility, industry, and grid).
APPLAUSE focused on photonics/optics packaging for light sensors and datacom transceivers; HIOS on highly integrated optoelectronic sensors.
INLINETEST developed in-line inspection using infrared thermography and thermoreflectance for quality control of packaged components.
APC's early H2020 work (2016–2017) centered on semiconductor pilot lines and sensor systems, contributing to broad manufacturing infrastructure projects like IoSense and R3-PowerUP that focused on energy-efficient power electronics. From 2018 onward, their focus shifted toward specialized packaging for photonics, optics, and quality assurance — projects like APPLAUSE and INLINETEST show a move from general pilot line participation toward higher-value packaging expertise and inspection capabilities. This evolution suggests APC is moving up the value chain from manufacturing support to specialized packaging knowledge.
APC is deepening its specialization in advanced packaging for photonics and optoelectronics, positioning itself as a go-to partner for European chip packaging challenges as the EU pushes semiconductor sovereignty.
APC operates exclusively as a participant — they have never coordinated an H2020 project, which is typical for a specialized SME contributing targeted technical expertise to larger consortia. With 126 unique partners across 18 countries in just 6 projects, they work in very large consortia (averaging 20+ partners per project), characteristic of the ECSEL/KDT-style semiconductor industry projects. This means they are well-networked across the European electronics ecosystem and comfortable operating in complex, multi-stakeholder environments.
APC has built an extensive network of 126 consortium partners across 18 countries through large-scale European semiconductor industry projects. Their network is heavily weighted toward the ECSEL Joint Undertaking ecosystem, connecting them to major European chip manufacturers, research institutes, and equipment suppliers.
APC fills a specific niche in Europe's semiconductor value chain: they are a dedicated packaging house, not a chip designer or fab. This makes them valuable to any consortium that needs advanced assembly, interconnect, or packaging expertise without the overhead of a large IDM. Based in the Netherlands — a hub of European semiconductor activity (NXP, ASML ecosystem) — they offer hands-on packaging capability that many research-focused partners lack.
