Advanced soldering and PCB assembly
3 European H2020 organizations list this as part of their work — 2 as their primary capability.
Most active in this area
- APPLIED MATERIALS ITALIA SRL
Global semiconductor equipment company contributing industrial fabrication, metrology, and PV manufacturing expertise to European R&D consortia.
“FineSol project targeted miniaturized PCB assembly using hyper-fine solder powders with jet and screen printing techniques.”
IT9 projects - MICROCHIP TECHNOLOGY CALDICOT LIMITED
UK semiconductor manufacturer specializing in advanced packaging, NEMS circuits, and industrialization of research-stage electronics for manufacturing and health monitoring.
“FineSol focused on hyper-fine solder powders for miniaturized PCBs; CITCOM on inspection techniques for MEMS components.”
PrimaryUK8 projects - PRISMA ELECTRONICS SA
Greek electronics SME providing sensor systems and detector hardware for physics research, maritime security, and health wearables.
“FineSol focused specifically on miniaturized PCB assembly using hyper-fine solder powders, indicating core manufacturing capability in electronics production.”
PrimarySMEEL7 projects